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1. WO2010056615 - ELECTRON BEAM WELDING OF LARGE VACUUM CHAMBER BODY HAVING A HIGH EMISSIVITY COATING

Publication Number WO/2010/056615
Publication Date 20.05.2010
International Application No. PCT/US2009/063671
International Filing Date 09.11.2009
IPC
H01L 21/00 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
H01L 21/02 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
CPC
B23K 15/0006
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
15Electron-beam welding or cutting
0006specially adapted for particular articles
B65D 7/06
BPERFORMING OPERATIONS; TRANSPORTING
65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
DCONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
7Containers having bodies formed by interconnecting or uniting two or more rigid, or substantially rigid, components made wholly or mainly of metal
02characterised by shape
06of polygonal cross-section, e.g. tins, boxes
B65D 7/38
BPERFORMING OPERATIONS; TRANSPORTING
65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
DCONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
7Containers having bodies formed by interconnecting or uniting two or more rigid, or substantially rigid, components made wholly or mainly of metal
12characterised by wall construction or by connections between walls
34with permanent connections between walls
38formed by soldering, welding, or otherwise uniting opposed surfaces
H01L 21/67379
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
673using specially adapted carriers ; or holders; Fixing the workpieces on such carriers or holders
6735Closed carriers
67379characterised by coupling elements, kinematic members, handles or elements to be externally gripped
Applicants
  • APPLIED MATERIALS, INC. [US]/[US] (AllExceptUS)
  • KURITA, Shinichi [JP]/[US] (UsOnly)
  • BEHDJAT, Mehran [US]/[US] (UsOnly)
  • INAGAWA, Makoto [JP]/[US] (UsOnly)
Inventors
  • KURITA, Shinichi
  • BEHDJAT, Mehran
  • INAGAWA, Makoto
Agents
  • PATTERSON, B. Todd
Priority Data
12/534,53403.08.2009US
61/114,87114.11.2008US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) ELECTRON BEAM WELDING OF LARGE VACUUM CHAMBER BODY HAVING A HIGH EMISSIVITY COATING
(FR) SOUDAGE PAR FAISCEAU D'ÉLECTRONS D'UN GRAND CORPS DE CHAMBRE À VIDE PRÉSENTANT UN REVÊTEMENT À HAUTE ÉMISSIVITÉ
Abstract
(EN)
Embodiments disclosed herein relate to a large vacuum chamber body that has been welded together. The chamber body may have a high emissivity coating on at least one surface therein. Due to the large size of the chamber body, the chamber body may be formed by welding several pieces together rather than forging the body from a single piece of metal. The pieces may be welded together at a location spaced from the corner of the body, which may be under the greatest stress during evacuation, to ensure that the weld, which may be the weakest point in the body, does not fail. At least one surface of the chamber body may be coated with a high emissivity coating to aid in heat transfer from incoming, heated substrates. The high emissivity coating may increase substrate throughput by lowering the time that may be needed to reduce the substrate temperature.
(FR)
La présente concerne divulgue dans ses modes de réalisation un grand corps de chambre à vide qui a été soudé. Le corps de chambre peut comporter un revêtement à haute émissivité sur au moins une de ses surfaces. En raison de la grande taille du corps de chambre, celui-ci peut être formé en soudant plusieurs pièces les unes aux autres plutôt qu'en forgeant le corps à partir d'une seule pièce de métal. Les pièces peuvent être soudées les unes aux autres en un endroit espacé du coin du corps, qui peut subir la plus forte contrainte lors de la mise sous vide, afin d'assurer que la soudure, qui peut constituer le point le plus faible du corps, ne cède pas. Au moins une surface du corps de chambre peut être revêtue d'un revêtement à haute émissivité afin de faciliter le transfert de chaleur à partir des substrats chauffés entrants. Le revêtement à haute émissivité peut augmenter le débit des substrats en abaissant le temps qui peut être nécessaire pour réduire la température du substrat.
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