Search International and National Patent Collections
Some content of this application is unavailable at the moment.
If this situation persists, please contact us atFeedback&Contact
1. (WO2010049837) AN INTEGRATED COMPONENT AND A METHOD OF MANUFACTURING AN INTEGRATED COMPONENT
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2010/049837 International Application No.: PCT/IB2009/054533
Publication Date: 06.05.2010 International Filing Date: 15.10.2009
IPC:
B81B 7/00 (2006.01)
B PERFORMING OPERATIONS; TRANSPORTING
81
MICRO-STRUCTURAL TECHNOLOGY
B
MICRO-STRUCTURAL DEVICES OR SYSTEMS, e.g. MICRO-MECHANICAL DEVICES
7
Micro-structural systems
Applicants:
NXP B.V. [NL/NL]; High Tech Campus 60 NL-5656 AG Eindhoven, NL (AllExceptUS)
YANG, Daoguo [CN/NL]; GB (UsOnly)
DRIEL, Willem, Dirk,Van [NL/NL]; GB (UsOnly)
ZAAL, Jeroen [NL/NL]; GB (UsOnly)
Inventors:
YANG, Daoguo; GB
DRIEL, Willem, Dirk,Van; GB
ZAAL, Jeroen; GB
Agent:
WILLIAMSON, Paul, L.; c/o NXP Semiconductors IP Department Betchworth House 57-65 Station Road Redhill Surrey RH1 1DL, GB
Priority Data:
08105689.729.10.2008EP
Title (EN) AN INTEGRATED COMPONENT AND A METHOD OF MANUFACTURING AN INTEGRATED COMPONENT
(FR) COMPOSANT INTÉGRÉ ET SON PROCÉDÉ DE FABRICATION
Abstract:
(EN) An integrated component (100) comprising a substrate (102), a cap (104) formed on the substrate (102) to enclose a cavity (106) with a surface of the substrate (102), and a reinforcement structure (108) for reinforcing the cap (104) and extending from a central portion of the cap (104) along the cap (104).
(FR) L’invention concerne un composant intégré (100) comprenant un substrat (102), un couvercle (104) disposé sur le substrat (102) pour fermer une cavité (106) formée avec la surface du substrat (102), et une structure de renforcement (108) pour renforcer le couvercle (104) s’étendant à partir d’une partie centrale du couvercle (104) le long du couvercle (104).
front page image
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)
Also published as:
EP2349914CN102196989