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Machine translation
1. (WO2010033454) WAFER HOLDER FOR SUPPORTING A SEMICONDUCTOR WAFER DURING A THERMAL TREATMENT PROCESS
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2010/033454    International Application No.:    PCT/US2009/056807
Publication Date: 25.03.2010 International Filing Date: 14.09.2009
Chapter 2 Demand Filed:    16.07.2010    
IPC:
H01L 21/687 (2006.01)
Applicants: MEMC ELECTRONIC MATERIALS, INC. [US/US]; 501 Pearl Drive St. Peters, Missouri 63376 (US) (For All Designated States Except US).
PITNEY, John, A. [US/US]; (US) (For US Only).
TORACK, Thomas, A. [US/US]; (US) (For US Only)
Inventors: PITNEY, John, A.; (US).
TORACK, Thomas, A.; (US)
Agent: CRAWFORD, David, E., Jr.; Senniger Powers LLP 100 North Broadway, 17th Floor St. Louis, Missouri 63102 (US)
Priority Data:
12/211,516 16.09.2008 US
Title (EN) WAFER HOLDER FOR SUPPORTING A SEMICONDUCTOR WAFER DURING A THERMAL TREATMENT PROCESS
(FR) SUPPORT DE TRANCHE ADAPTÉ POUR SUPPORTER UNE TRANCHE SEMI-CONDUCTRICE DURANT UN PROCESSUS DE TRAITEMENT THERMIQUE
Abstract: front page image
(EN)A wafer holder for holding a semiconductor wafer during a thermal wafer treatment process. The wafer holder includes at least three wafer supports. Each wafer support includes an upright shaft and a plurality of flexible fibers supported by the shaft in positions such that at least some of the fibers engage the semiconductor wafer when the wafer rests on the wafer supports.
(FR)La présente invention concerne un support de tranche adapté pour supporter une tranche semi-conductrice durant un processus de traitement thermique. Le support de tranche comprend au moins trois dispositifs de support de tranche. Chaque dispositif de support de tranche comprend un arbre vertical et une pluralité de fibres souples supportée par l’arbre dans des positions telles qu'au moins une partie des fibres se met en prise avec la tranche semi-conductrice lorsque la tranche repose sur les dispositifs de support de tranche.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)