WIPO logo
Mobile | Deutsch | Español | Français | 日本語 | 한국어 | Português | Русский | 中文 | العربية |
PATENTSCOPE

Search International and National Patent Collections
World Intellectual Property Organization
Search
 
Browse
 
Translate
 
Options
 
News
 
Login
 
Help
 
Machine translation
1. (WO2010033322) STACKING QUAD PRE-MOLDED COMPONENT PACKAGES, SYSTEMS USING THE SAME, AND METHODS OF MAKING THE SAME
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2010/033322    International Application No.:    PCT/US2009/053597
Publication Date: 25.03.2010 International Filing Date: 12.08.2009
IPC:
H01L 23/12 (2006.01), H01L 23/495 (2006.01)
Applicants: FAIRCHILD SEMICONDUCTOR CORPORATION [US/US]; 82 Running Hill Road, MS 35-4E South Portland, ME 04106 (US) (For All Designated States Except US).
LIU, Yong [US/US]; (US) (For US Only).
ALLEN, Howard [US/US]; (US) (For US Only).
QIAN, Qiuxiao [CN/CN]; (CN) (For US Only)
Inventors: LIU, Yong; (US).
ALLEN, Howard; (US).
QIAN, Qiuxiao; (CN)
Agent: YEAGER, Hal R.; (US)
Priority Data:
12/235,227 22.09.2008 US
Title (EN) STACKING QUAD PRE-MOLDED COMPONENT PACKAGES, SYSTEMS USING THE SAME, AND METHODS OF MAKING THE SAME
(FR) ENSEMBLES DE COMPOSANTS PRÉMOULÉS DE QUARTE D'EMPILAGE, SYSTÈMES UTILISANT CEUX-CI, ET PROCÉDÉS DE FABRICATION ASSOCIÉS
Abstract: front page image
(EN)Pre-molded component packages that may be as thin as a leadframe for a semiconductor die, systems using the same, and methods of making the same are disclosed. The leads of an exemplary package are exposed at both surfaces at the leadframe. The packages may be stacked upon one another and electrically coupled at the exposed portions of their leads.
(FR)L'invention concerne des ensembles de composants prémoulés pouvant être aussi minces qu'une grille de connexion pour une puce semi-conductrice, les systèmes utilisant ces ensembles, et des procédés de fabrication associés. Les fils de sortie d'un ensemble exemplaire sont exposés sur les deux surfaces au niveau de la grille de connexion. Les ensembles peuvent être empilés les uns au-dessus des autres et couplés électriquement sur les parties exposées de leurs fils de sortie.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)