WIPO logo
Mobile | Deutsch | Español | Français | 日本語 | 한국어 | Português | Русский | 中文 | العربية |
PATENTSCOPE

Search International and National Patent Collections
World Intellectual Property Organization
Search
 
Browse
 
Translate
 
Options
 
News
 
Login
 
Help
 
Machine translation
1. (WO2010032827) ELECTRIC COMPONENT, STRUCTURE FOR MOUNTING THE ELECTRIC COMPONENT, AND METHOD FOR MOUNTING THE ELECTRIC COMPONENT
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2010/032827    International Application No.:    PCT/JP2009/066361
Publication Date: 25.03.2010 International Filing Date: 18.09.2009
IPC:
H01R 4/02 (2006.01), H01R 43/02 (2006.01), H05K 1/18 (2006.01), H05K 3/34 (2006.01), H01H 19/08 (2006.01)
Applicants: ALPS ELECTRIC CO., LTD. [JP/JP]; 1-7, Yukigaya-otsukamachi, Ota-ku, Tokyo 1458501 (JP) (For All Designated States Except US).
MIZOBUCHI, Shinichi [JP/JP]; (JP) (For US Only).
ISHIKAWA, Yoshinori [JP/JP]; (JP) (For US Only).
SATO, Yuji [JP/JP]; (JP) (For US Only)
Inventors: MIZOBUCHI, Shinichi; (JP).
ISHIKAWA, Yoshinori; (JP).
SATO, Yuji; (JP)
Agent: NOZAKI, Teruo; (JP)
Priority Data:
2008-239906 18.09.2008 JP
2009-143468 16.06.2009 JP
Title (EN) ELECTRIC COMPONENT, STRUCTURE FOR MOUNTING THE ELECTRIC COMPONENT, AND METHOD FOR MOUNTING THE ELECTRIC COMPONENT
(FR) COMPOSANT ÉLECTRIQUE, STRUCTURE DE MONTAGE DU COMPOSANT ÉLECTRIQUE, ET PROCÉDÉ DE MONTAGE DU COMPOSANT ÉLECTRIQUE
(JA) 電気部品、及び前記電気部品の実装構造、ならびに、前記電気部品の実装方法
Abstract: front page image
(EN)Provided is an electric component wherein a good solder fillet can be formed, especially when a connecting terminal section is inserted into a through hole of a printed board and soldered by a reflow method, and high mounting reliability can be obtained.  A structure for mounting the electric component and a method for mounting the electric component are also provided. Connecting terminal sections (17, 18) which configure the rotating electric component has outer circumferential surfaces (17a, 18a), i.e., curved surfaces, formed by bending metal plates (3, 6).  Leading ends (17b, 18b) of the connecting terminal sections (17, 18) form a push-out section (37) which pushes out a cream solder applied in the through hole, and the leading ends function as a sucking section (38) for sucking the solder, which is molten by the heated outer circumferential surfaces (17a, 18a), into between the outer circumferential surfaces and the inner wall of the through hole.
(FR)
(JA)【課題】 特に、接続端子部をプリント基板のスルーホールに挿入してリフロー半田付けしたときに、きれいな半田フィレットを形成でき、高い実装信頼性を得ることが可能な電気部品、及び前記電気部品の実装構造、ならびに、前記電気部品の実装方法を提供することを目的としている。 【解決手段】 回転型電気部品を構成する接続端子部17,18は、金属板3,6を曲げ加工して外周面17a,18aが曲面で形成されている。接続端子部17,18の先端17b,18bがスルーホールに充填されたクリーム半田を押し出すための押し出し部37であり、外周面17a,18aが加熱して溶融した半田をスルーホールの内壁との間に吸引するための吸引部38として機能する。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)