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1. (WO2010032529) SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2010/032529    International Application No.:    PCT/JP2009/061596
Publication Date: 25.03.2010 International Filing Date: 25.06.2009
IPC:
H01L 21/52 (2006.01), C09J 4/00 (2006.01), C09J 7/00 (2006.01), C09J 11/06 (2006.01), C09J 163/00 (2006.01), C09J 179/04 (2006.01), C09J 201/00 (2006.01)
Applicants: HITACHI CHEMICAL COMPANY, LTD. [JP/JP]; 1-1, Nishi-Shinjuku 2-chome, Shinjuku-ku, Tokyo 1630449 (JP) (For All Designated States Except US).
KAWAMORI Takashi [JP/JP]; (JP) (For US Only).
MITSUKURA Kazuyuki [JP/JP]; (JP) (For US Only).
MASUKO Takashi [JP/JP]; (JP) (For US Only).
KATOGI Shigeki [JP/JP]; (JP) (For US Only)
Inventors: KAWAMORI Takashi; (JP).
MITSUKURA Kazuyuki; (JP).
MASUKO Takashi; (JP).
KATOGI Shigeki; (JP)
Agent: HASEGAWA Yoshiki; SOEI PATENT AND LAW FIRM Marunouchi MY PLAZA (Meiji Yasuda Life Bldg.) 9th fl. 1-1, Marunouchi 2-chome Chiyoda-ku, Tokyo 1000005 (JP)
Priority Data:
2008-242765 22.09.2008 JP
Title (EN) SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
(FR) DISPOSITIF À SEMI-CONDUCTEURS ET SON PROCÉDÉ DE FABRICATION
(JA) 半導体装置及びその製造方法
Abstract: front page image
(EN)Disclosed is a semiconductor device having excellent heat resistance, wherein a semiconductor element and an object to be bonded are bonded together through a patterned film-like photosensitive adhesive by means of thermal compression bonding. In the semiconductor device, the water content in the patterned film-like photosensitive adhesive right before the thermal compression bonding is not more than 1.0% by weight.
(FR)L'invention porte sur un dispositif à semi-conducteurs ayant une excellente résistance à la chaleur, dans lequel un élément semi-conducteur et un objet devant être collés sont collés ensemble par un adhésif photosensible du type film à motifs au moyen d'un assemblage par compression thermique. Dans le dispositif à semi-conducteurs, la teneur en eau dans l'adhésif photosensible du type film à motifs juste avant l'assemblage par compression thermique n'est pas supérieure à 1,0 % en poids.
(JA) 本発明は、耐熱性に優れる半導体装置を提供することを目的として、半導体素子と被着体とが、パターン化されたフィルム状感光性接着剤を介して熱圧着されてなる半導体装置であって、パターン化されたフィルム状感光性接着剤の熱圧着直前の水分量が1.0重量%以下である半導体装置を提供する。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)