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1. WO2010031373 - HOUSING FOR AN OPTOELECTRONIC COMPONENT

Publication Number WO/2010/031373
Publication Date 25.03.2010
International Application No. PCT/DE2009/001223
International Filing Date 31.08.2009
IPC
H01L 33/00 2010.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
H01L 33/48 2010.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48characterised by the semiconductor body packages
CPC
H01L 2924/0002
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2924Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
0001Technical content checked by a classifier
0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
H01L 33/48
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48characterised by the semiconductor body packages
H01L 33/486
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48characterised by the semiconductor body packages
483Containers
486adapted for surface mounting
H01L 33/52
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48characterised by the semiconductor body packages
52Encapsulations
H01L 33/62
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48characterised by the semiconductor body packages
62Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
Applicants
  • OSRAM OPTO SEMICONDUCTORS GMBH [DE]/[DE] (AllExceptUS)
  • ARNDT, Karlheinz [DE]/[DE] (UsOnly)
Inventors
  • ARNDT, Karlheinz
Agents
  • MUCH, Florian
Priority Data
10 2008 048 259.522.09.2008DE
Publication Language German (de)
Filing Language German (DE)
Designated States
Title
(DE) GEHÄUSE FÜR EIN OPTOELEKTRONISCHES BAUTEIL
(EN) HOUSING FOR AN OPTOELECTRONIC COMPONENT
(FR) BOÎTIER POUR COMPOSANT OPTOÉLECTRONIQUE
Abstract
(DE) Es wird ein Gehäuse (1) für ein optoelektronisches Bauteil angegeben. Das Gehäuse (1) umfasst einen Gehäusekörper (2) und einen ersten und zweiten elektrischen Anschlussstreifen (11, 12), die teilweise innerhalb des Gehäusekörpers (2) verlaufen und an einer ersten Seitenfläche (4a) aus dem Gehäusekörper (2) herausgeführt sind. Außerhalb des Gehäusekörpers (2) sind die beiden Anschlussstreifen (11, 12) derart abgewinkelt, dass sie einen ersten Abschnitt (11c, 12c), der sich quer zur ersten Seitenfläche (4a) erstreckt, und einen zweiten Abschnitt (11d, 12d) aufweisen, der sich in einem Abstand (D) entlang der ersten Seitenfläche (4a) erstreckt. Weiterhin wird ein Verfahren zur Herstellung eines derartigen Gehäuses (1) angegeben.
(EN) A housing (1) for an optoelectronic component is specified. The housing (1) comprises a housing body (2) and a first and a second electrical connection strip (11, 12), which connection strips run partially inside the housing body (2) and are routed out of the housing body (2) on a first side surface (4a). Outside the housing body (2), the two connection strips (11, 12) are bent in such a manner that they have a first section (11c, 12c), which extends transversely with respect to the first side surface (4a), and a second section (11d, 12d) which extends along the first side surface (4a) at a distance (D). A method for producing such a housing (1) is also specified.
(FR) La présente invention concerne un boîtier (1) destiné à un composant optoélectronique. Le boîtier (1) comprend un corps (2) et une première et une deuxième patte de connexion électrique (11, 12) qui s'étendent en partie à l'intérieur du corps (2) du boîtier et sortent du corps (2) du boîtier au niveau d'une première face latérale (4a). A l'extérieur du corps (2) du boîtier, les deux pattes de connexion (11, 12) sont coudées de sorte qu'elles forment une première section (11c, 12c) qui s'étend transversalement en direction de la première face latérale (4a), et une seconde section (11d, 12d) qui s'étend le long de la première face latérale (4a) à une certaine distance (D) de celle-ci. L'invention concerne également un procédé permettant la réalisation d'un boîtier (1) de ce type.
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