WIPO logo
Mobile | Deutsch | Español | Français | 日本語 | 한국어 | Português | Русский | 中文 | العربية |
PATENTSCOPE

Search International and National Patent Collections
World Intellectual Property Organization
Search
 
Browse
 
Translate
 
Options
 
News
 
Login
 
Help
 
Machine translation
1. (WO2010030799) STACKED DEVICE IDENTIFICATION ASSIGNMENT
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2010/030799    International Application No.:    PCT/US2009/056538
Publication Date: 18.03.2010 International Filing Date: 10.09.2009
IPC:
H01L 23/12 (2006.01), H01L 23/48 (2006.01)
Applicants: MICRON TECHNOLOGY, INC. [US/US]; 8000 So. Federal Way Boise, Idaho 83716-9632 (US) (For All Designated States Except US).
KEETH, Brent [US/US]; (US) (For US Only)
Inventors: KEETH, Brent; (US)
Agent: MADDEN, Robert B.; (US)
Priority Data:
12/209,048 11.09.2008 US
Title (EN) STACKED DEVICE IDENTIFICATION ASSIGNMENT
(FR) ATTRIBUTION D’IDENTIFICATION POUR DISPOSITIF EMPILÉ
Abstract: front page image
(EN)Some embodiments include apparatus and methods having dice arranged in a stack. The dice include at least a first die and a second die, and a connection coupled to the dice. The connection may be configured to transfer control information to the first die during an assignment of a first identification to the first die and to transfer the control information from the first die to the second die during an assignment of a second identification to the second die.
(FR)Selon certains modes de réalisation, l’invention concerne un appareil et des procédés faisant appel à des puces disposées en un empilement. Les puces comprennent au moins une première puce et une seconde puce, et une connexion couplée aux puces. La connexion peut être configurée de manière à transférer des informations de commande vers la première puce pendant l’attribution d’une première identification à la première puce, et à transférer des informations de commande de la première puce à la seconde puce pendant l’attribution d’une seconde identification à la seconde puce.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)