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1. (WO2010030557) SYSTEM AND METHOD UTILIZING REDUNDANCY IN SEMICONDUCTOR CHIP INTERCONNECTS
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2010/030557    International Application No.:    PCT/US2009/055854
Publication Date: 18.03.2010 International Filing Date: 03.09.2009
IPC:
H01L 25/00 (2006.01)
Applicants: QUALCOMM Incorporated [US/US]; Attn: International IP Administration 5775 Morehouse Drive San Diego, California 92121 (US) (For All Designated States Except US).
LAISNE, Michael [US/US]; (US) (For US Only).
ARABI, Karim [US/US]; (US) (For US Only).
PETROV, Tsvetomir [US/US]; (US) (For US Only)
Inventors: LAISNE, Michael; (US).
ARABI, Karim; (US).
PETROV, Tsvetomir; (US)
Agent: KAMARCHIK, Peter; (US)
Priority Data:
61/095,855 10.09.2008 US
12/480,754 09.06.2009 US
Title (EN) SYSTEM AND METHOD UTILIZING REDUNDANCY IN SEMICONDUCTOR CHIP INTERCONNECTS
(FR) SYSTÈME ET PROCÉDÉ UTILISANT LA REDONDANCE DANS DES INTERCONNEXIONS DE PUCES SEMI-CONDUCTRICES
Abstract: front page image
(EN)An integrated circuit, or combination of integrated circuits, has a primary interconnect, a redundant interconnect, and circuitry connecting the primary and redundant interconnects allowing selection of the redundant interconnect to bypass the primary interconnect.
(FR)L'invention concerne un circuit intégré, ou une combinaison de circuits intégrés, comportant une interconnexion primaire, une interconnexion redondante, et un circuit connectant les interconnexions primaire et secondaire et permettant de choisir l'interconnexion redondante afin d'éviter l'interconnexion primaire.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)