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1. WO2010029635 - METHOD FOR METALLIC WIRING FORMATION AND ELECTRONIC COMPONENT COMPRISING METALLIC WIRING

Publication Number WO/2010/029635
Publication Date 18.03.2010
International Application No. PCT/JP2008/066472
International Filing Date 11.09.2008
IPC
H05K 3/18 2006.1
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
10in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
18using precipitation techniques to apply the conductive material
B32B 15/04 2006.1
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
15Layered products essentially comprising metal
04comprising metal as the main or only constituent of a layer, next to another layer of a specific substance
CPC
H05K 3/102
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
10in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
102by bonding of conductive powder, i.e. metallic powder
H05K 3/185
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
10in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
18using precipitation techniques to apply the conductive material
181by electroless plating
182characterised by the patterning method
185by making a catalytic pattern by photo-imaging
H05K 3/389
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
38Improvement of the adhesion between the insulating substrate and the metal
389by the use of a coupling agent, e.g. silane
Applicants
  • パイオニア株式会社 PIONEER CORPORATION [JP]/[JP] (AllExceptUS)
  • 秦 拓也 HATA, Takuya [JP]/[JP] (UsOnly)
Inventors
  • 秦 拓也 HATA, Takuya
Agents
  • 水野 勝文 MIZUNO, Katsufumi
Priority Data
Publication Language Japanese (ja)
Filing Language Japanese (JA)
Designated States
Title
(EN) METHOD FOR METALLIC WIRING FORMATION AND ELECTRONIC COMPONENT COMPRISING METALLIC WIRING
(FR) PROCÉDÉ DE FORMATION D’UN CÂBLAGE MÉTALLIQUE ET COMPOSANT ÉLECTRONIQUE COMPRENANT UN CÂBLAGE MÉTALLIQUE
(JA) 金属配線の形成方法、及び金属配線を備えた電子部品
Abstract
(EN) [PROBLEMS] To provide a method for metallic wiring formation, which can form a metallic wiring of an ultrathin film, and an electronic component comprising a metallic wiring of an ultrathin film. [MEANS FOR SOLVING PROBLEMS] A compound containing an ethoxysilane group or methoxysilane group and a thiol group is utilized to prepare a large number of metallic fine particles previously covered on their surface with the above compound by chemical bonding of the thiol group in the compound. The ethoxysilane group or the methoxysilane group is hydrolyzed to give a silanol group which is then chemically bonded to a substrate surface on which a metallic wiring is to be formed, whereby the metallic fine particles are fixed onto the substrate surface. The metallic wiring may be formed of the metallic fine particles only. Alternatively, the same type of or a dissimilar metal may be thickly deposited by electroless plating in the presence of the metallic fine particles as a catalyst.
(FR) La présente invention concerne un procédé destiné à la formation d’un câblage métallique, qui peut former un câblage métallique d’un film ultrafin, et un composant électronique comprenant un câblage métallique d’un film ultrafin. Un composé contenant un groupe éthoxysilane ou un méthoxysilane et un groupe thiol est utilisé pour préparer un grand nombre de particules fines métalliques recouvertes au préalable sur leur surface avec le composé susmentionné grâce à la liaison chimique du groupe thiol contenu dans le composé. Le groupe éthoxysilane ou le groupe méthoxysilane est hydrolysé pour donner un groupe silanol qui est ensuite lié chimiquement à la surface d’un substrat sur laquelle un câblage métallique doit être formé, les fines particules métalliques étant fixées sur la surface du substrat. Le câblage métallique peut être formé uniquement des fines particules métalliques. En variante, le même type de métal, ou un métal différent, peut être déposé en couche épaisse grâce à un placage autocatalytique en présence des fines particules métalliques en tant que catalyseur.
(JA) 【課題】極薄膜の金属配線を形成することが可能な金属配線の形成方法、及び極薄膜の金属配線を備えた電子部品を提供する。 【解決手段】エトキシシラン基又はメトキシシラン基と、チオール基とを有する化合物を利用し、前記化合物のチオール基が化学的に結合することにより、表面が予め前記化合物で被覆された金属微粒子の多数を準備し、前記エトキシシラン基又はメトキシシラン基を加水分解させることで生成させたシラノール基を、金属配線を形成しようとする下地面に化学的に結合させることによって前記金属微粒子を下地面に固着させる。さらに、前記金属微粒子のみで金属配線を形成してもよく、前記金属微粒子を触媒として無電解メッキにより同種又は異種の金属を厚付けしてもよい。
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