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1. WO2010029075 - ROTATABLE, HEATABLE PLACEMENT TOOL AND CHIP MOUNTING SYSTEM COMPRISING SUCH A PLACEMENT TOOL

Publication Number WO/2010/029075
Publication Date 18.03.2010
International Application No. PCT/EP2009/061634
International Filing Date 08.09.2009
Chapter 2 Demand Filed 22.03.2010
IPC
H01L 21/683 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
683for supporting or gripping
H01L 21/60 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/06-H01L21/326162
60Attaching leads or other conductive members, to be used for carrying current to or from the device in operation
CPC
H01L 21/67121
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
67005Apparatus not specifically provided for elsewhere
67011Apparatus for manufacture or treatment
67121Apparatus for making assemblies not otherwise provided for, e.g. package constructions
H01L 21/67132
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
67005Apparatus not specifically provided for elsewhere
67011Apparatus for manufacture or treatment
67132Apparatus for placing on an insulating substrate, e.g. tape
H01L 21/67144
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
67005Apparatus not specifically provided for elsewhere
67011Apparatus for manufacture or treatment
67144Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
H01L 21/68
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
68for positioning, orientation or alignment
H01L 21/683
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
683for supporting or gripping
H01L 21/6838
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
683for supporting or gripping
6838with gripping and holding devices using a vacuum; Bernoulli devices
Applicants
  • KULICKE AND SOFFA DIE BONDING GMBH [CH]/[CH] (AllExceptUS)
  • TRINKS, Joachim [CH]/[CH] (UsOnly)
Inventors
  • TRINKS, Joachim
Common Representative
  • KULICKE AND SOFFA DIE BONDING GMBH
Priority Data
61/095,41709.09.2008US
Publication Language German (de)
Filing Language German (DE)
Designated States
Title
(DE) DREHBARES, BEHEIZBARES PLATZIERWERKZEUG UND CHIPMONTAGEAUTOMAT MIT EINEM SOLCHEN PLATZIERWERZEUG
(EN) ROTATABLE, HEATABLE PLACEMENT TOOL AND CHIP MOUNTING SYSTEM COMPRISING SUCH A PLACEMENT TOOL
(FR) OUTIL DE POSITIONNEMENT POUVANT ÊTRE CHAUFFÉ ET TOURNÉ, ET MICROSOUDEUSE DE PUCES ÉQUIPÉE D'UN TEL OUTIL DE POSITIONNEMENT
Abstract
(DE) Ein Platzierwerkzeug, welches in Richtung einer z-Achse senkrecht zu einem Substrat bewegbar ist, umfasst: ein Halteelement für ein Halbleiterbauelement, welches ein Heizelement aufweist; eine Aufnahme für das Halteelement, welche drehbar um die z-Achse am Platzierwerkzeug gelagert ist und einen Isolationskörper aus wärmeisolierendem Material aufweist; einen Antrieb für die Aufnahme, mittels welchem die Aufnahme um die z-Achse gedreht werden kann; und eine Zuführung für ein Kühlfluid, mittels welchem die Aufnahme für das Halteelement gekühlt werden kann.
(EN) A placement tool, which can move in the direction of a z-axis perpendicular to a substrate, comprises: a carriage element for a semiconductor component, said carriage element comprising a heating element; a receptacle for the carriage element, said receptacle being mounted rotatably about the z-axis at the placement tool and comprising an insulation member made of thermally insulating material; a drive for the receptacle for rotating the receptacle about the z-axis; and a feed for a cooling fluid for cooling the receptacle for the carriage element.
(FR) L'invention concerne un outil de positionnement qui est mobile en direction d'un axe z perpendiculairement à un substrat et qui comporte un élément de maintien pour un composant semi-conducteur, cet élément de maintien comportant un élément chauffant; un support pour l'élément de maintien, ce support étant monté rotatif autour de l'axe z sur l'outil de positionnement et comportant un corps isolant constitué d'un matériau thermo-isolant; un entraînement pour le support, permettant de faire tourner le support autour de l'axe z; et une conduite pour un fluide de refroidissement qui refroidit le support pour l'élément de maintien.
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