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1. (WO2010028353) WAFER EDGE INSPECTION
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2010/028353    International Application No.:    PCT/US2009/056208
Publication Date: 11.03.2010 International Filing Date: 08.09.2009
IPC:
G01N 21/00 (2006.01)
Applicants: RUDOLPH TECHNOLOGIES, INC. [US/US]; One Rudolph Road Flanders, New Jersey 07836 (US) (For All Designated States Except US).
VOGES, Christopher [US/US]; (US) (For US Only).
PAI, Ajay [IN/US]; (US) (For US Only).
PHILLIP, Antony Ravi [US/US]; (US) (For US Only).
LE, Tuan D. [US/US]; (US) (For US Only).
ZHOU, Wei [CN/US]; (US) (For US Only)
Inventors: VOGES, Christopher; (US).
PAI, Ajay; (US).
PHILLIP, Antony Ravi; (US).
LE, Tuan D.; (US).
ZHOU, Wei; (US)
Agent: CZAJA, Timothy A.; (US)
Priority Data:
61/095,207 08.09.2008 US
Title (EN) WAFER EDGE INSPECTION
(FR) INSPECTION DE BORD DE PLAQUETTE
Abstract: front page image
(EN)Wafer edge inspection approaches are disclosed wherein an imaging device captures at least one image of an edge of a wafer. The at least one image can be analyzed in order to identify an edge bead removal line. An illumination system having a diffuser can further be used in capturing images.
(FR)L’invention concerne des méthodes d’inspection de bords de plaquettes, qui utilisent un dispositif d’imagerie afin de capturer au moins une image d’un bord de plaquette. Ladite ou lesdites images peuvent être analysées afin d’identifier une ligne d’élimination de perle latérale. Un système d'éclairage comportant un diffuseur peut également être utilisé afin de capturer des images.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)