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Machine translation
1. (WO2010027406) COPPER LAYER PROCESSING
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2010/027406    International Application No.:    PCT/US2009/004693
Publication Date: 11.03.2010 International Filing Date: 17.08.2009
IPC:
H01L 21/3065 (2006.01), H01L 21/28 (2006.01)
Applicants: MICRON TECHNOLOGY, INC. [US/US]; 8000 S Federal Way Boise, ID 83716-9632 (US) (For All Designated States Except US).
RUEGER, Neal, R. [US/US]; (US) (For US Only)
Inventors: RUEGER, Neal, R.; (US)
Agent: KERN, Jacob, T.; Brooks, Cameron & Huebsch, PLLC 1221 Nicollet Avenue, Suite 500 Minneapolis, MN 55403 (US)
Priority Data:
12/203,460 03.09.2008 US
Title (EN) COPPER LAYER PROCESSING
(FR) TRAITEMENT DE COUCHES DE CUIVRE
Abstract: front page image
(EN)The present disclosure includes devices, methods, and systems for processing copper and, in particular, copper layer processing using sulfur plasma, One or more embodiments can include a method of forming a copper sulfur compound by reacting copper with a plasma gas including sulfur and removing at least a portion of the copper sulfur compound with water.
(FR)La présente invention concerne des dispositifs, des procédés et des systèmes pour le traitement du cuivre et, en particulier, le traitement de couches de cuivre à l'aide d'un plasma de soufre. Dans un ou plusieurs modes de réalisation, l'invention décrit un procédé de formation d'un composé de cuivre-soufre par la réaction du cuivre avec un plasma gazeux contenant du soufre et l'élimination d'au moins une partie du composé de cuivre-soufre avec de l'eau.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)