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1. (WO2010027070) HIGHLY HEAT CONDUCTIVE POLYIMIDE FILM, HIGHLY HEAT CONDUCTIVE METAL-CLAD LAMINATE AND METHOD FOR PRODUCING SAME
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2010/027070 International Application No.: PCT/JP2009/065582
Publication Date: 11.03.2010 International Filing Date: 07.09.2009
IPC:
B32B 15/088 (2006.01) ,B32B 15/08 (2006.01) ,B32B 15/16 (2006.01) ,C08J 5/18 (2006.01) ,C08K 3/10 (2006.01) ,C08K 7/04 (2006.01) ,C08L 79/08 (2006.01) ,H05K 1/03 (2006.01)
B PERFORMING OPERATIONS; TRANSPORTING
32
LAYERED PRODUCTS
B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
15
Layered products essentially comprising metal
04
comprising metal as the main or only constituent of a layer, next to another layer of a specific substance
08
of synthetic resin
088
comprising polyamides
B PERFORMING OPERATIONS; TRANSPORTING
32
LAYERED PRODUCTS
B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
15
Layered products essentially comprising metal
04
comprising metal as the main or only constituent of a layer, next to another layer of a specific substance
08
of synthetic resin
B PERFORMING OPERATIONS; TRANSPORTING
32
LAYERED PRODUCTS
B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
15
Layered products essentially comprising metal
16
next to a particulate layer
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
J
WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H142
5
Manufacture of articles or shaped materials containing macromolecular substances
18
Manufacture of films or sheets
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
3
Use of inorganic ingredients
10
Metal compounds
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
7
Use of ingredients characterised by shape
02
Fibres or whiskers
04
inorganic
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
79
Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08L61/-C08L77/259
04
Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
08
Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
02
Details
03
Use of materials for the substrate
Applicants:
青▲柳▼ 栄次郎 AOYAGI Eijiro [JP/JP]; JP (UsOnly)
王 宏遠 WANG Hongyuan [CN/JP]; JP (UsOnly)
切替 徳之 KIRIKAE Noriyuki [JP/JP]; JP (UsOnly)
平石 克文 HIRAISHI Katsufumi [JP/JP]; JP (UsOnly)
新日鐵化学株式会社 NIPPON STEEL CHEMICAL CO., LTD. [JP/JP]; 東京都千代田区外神田四丁目14番1号 14-1, Sotokanda 4-chome, Chiyoda-ku, Tokyo 1010021, JP (AllExceptUS)
Inventors:
青▲柳▼ 栄次郎 AOYAGI Eijiro; JP
王 宏遠 WANG Hongyuan; JP
切替 徳之 KIRIKAE Noriyuki; JP
平石 克文 HIRAISHI Katsufumi; JP
Agent:
佐々木 一也 SASAKI Kazuya; JP
Priority Data:
2008-22970608.09.2008JP
2008-25007429.09.2008JP
Title (EN) HIGHLY HEAT CONDUCTIVE POLYIMIDE FILM, HIGHLY HEAT CONDUCTIVE METAL-CLAD LAMINATE AND METHOD FOR PRODUCING SAME
(FR) FILM DE POLYIMIDE HAUTEMENT THERMO-CONDUCTEUR, STRATIFIÉ BLINDÉ HAUTEMENT THERMO-CONDUCTEUR ET PROCÉDÉ DE PRODUCTION ASSOCIÉ
(JA) 高熱伝導性ポリイミドフィルム、高熱伝導性金属張積層体及びその製造方法
Abstract:
(EN) Disclosed is a highly heat conductive metal-clad laminate having heat resistance, dimensional stability, workability and adhesiveness, while exhibiting excellent thermal conductivity characteristics.  Also disclosed is a highly heat conductive polyimide film. The highly heat conductive metal-clad laminate has a metal layer on one or both sides of an insulating layer which has a heat conductive filler-containing polyimide resin layer.  The insulating layer of the highly heat conductive metal-clad laminate or a highly heat conductive polyimide film having the filler-containing polyimide resin layer is characterized in that the heat conductive filler content in the filler-containing polyimide resin layer is 20-80 wt%, that the heat conductive filler contains a plate-like filler having an average length DL of 0.1-15 μm and a spherical filler having an average particle diameter DR of 0.05-10 μm, with the relation between DL and DR satisfying DL > DR/2, that a heat conductive filler of 30 μm or more is not contained therein, and that the insulating layer or polyimide film has a thermal expansion coefficient within the range of 10-30 ppm/K.
(FR) L’invention concerne un stratifié blindé hautement thermo-conducteur ayant une résistance à la chaleur, une stabilité dimensionnelle, une usinabilité et une adhésivité, tout en présentant d’excellentes caractéristiques de thermo-conductivité. L’invention concerne également un film de polyimide hautement thermo-conducteur. Le stratifié blindé hautement thermo-conducteur a une couche de métal sur l’un des côtés ou sur les deux côtés d’une couche isolante, dotée d’une couche de résine de polyimide contenant une charge thermo-conductrice. La couche isolante du stratifié blindé hautement thermo-conducteur ou un film de polyimide hautement thermo-conducteur ayant la couche de résine de polyimide contenant une charge est caractérisée en ce que la teneur en charge thermo-conductrice dans la couche de résine de polyimide contenant la charge est comprise entre 20 et 80 % en poids, la charge thermo-conductrice contient une charge semblable à une plaque ayant une longueur moyenne DL de 0,1-15 μm et une charge sphérique ayant un diamètre moyen de particule DR de 0,05-10 μm, la relation entre DL et DR satisfaisant DL > DR/2, une charge thermo-conductrice de 30 μm ou plus n’est pas contenue à l’intérieur, et la couche isolante ou film de polyimide a un coefficient de dilatation thermique compris dans la plage de 10-30 ppm/K.
(JA)  耐熱性、寸法安定性に加え、加工性と接着性を有し、熱伝導特性に優れる高熱伝導性金属張積層体、及び高熱伝導性ポリイミドフィルムを提供する。  この高熱伝導性金属張積層体は、熱伝導性フィラー含有ポリイミド樹脂層を有する絶縁層の片面又は両面に金属層を有する。そして、上記高熱伝導性金属張積層体の絶縁層、又は上記フィラー含有ポリイミド樹脂層を有する高熱伝導性ポリイミドフィルムは、フィラー含有ポリイミド樹脂層中の熱伝導性フィラーの含有割合が20~80wt%であり、熱伝導性フィラーは平均長径DLが0.1~15μmの板状フィラーと、平均粒径DRが0.05~10μmの球状フィラーを含有し、DLとDRとの関係がDL>DR/2を満足し、30μm以上の熱伝導性フィラーを含有せず、かつ熱膨張係数が10~30ppm/Kの範囲にある。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (EPO) (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)