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1. WO2010026910 - SHEET PEELING APPARATUS AND SHEET PEELING METHOD

Publication Number WO/2010/026910
Publication Date 11.03.2010
International Application No. PCT/JP2009/064911
International Filing Date 27.08.2009
IPC
H01L 21/683 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
683for supporting or gripping
CPC
H01L 21/304
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
18the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
302to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
304Mechanical treatment, e.g. grinding, polishing, cutting
H01L 21/50
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, ; e.g. sealing of a cap to a base of a container
H01L 21/67132
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
67005Apparatus not specifically provided for elsewhere
67011Apparatus for manufacture or treatment
67132Apparatus for placing on an insulating substrate, e.g. tape
H01L 21/683
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
683for supporting or gripping
Y10S 156/93
YSECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
10TECHNICAL SUBJECTS COVERED BY FORMER USPC
STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
156Adhesive bonding and miscellaneous chemical manufacture
918Delaminating processes adapted for specified product, e.g. delaminating medical specimen slide
93Semiconductive product delaminating, e.g. delaminating emiconductive wafer from underlayer
Y10S 156/941
YSECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
10TECHNICAL SUBJECTS COVERED BY FORMER USPC
STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
156Adhesive bonding and miscellaneous chemical manufacture
934Apparatus having delaminating means adapted for delaminating a specified article
941Means for delaminating semiconductive product
Applicants
  • リンテック株式会社 LINTEC CORPORATION [JP]/[JP] (AllExceptUS)
  • 小林賢治 KOBAYASHI Kenji [JP]/[JP] (UsOnly)
Inventors
  • 小林賢治 KOBAYASHI Kenji
Agents
  • 山口義雄 YAMAGUCHI Yoshio
Priority Data
2008-22691704.09.2008JP
Publication Language Japanese (ja)
Filing Language Japanese (JA)
Designated States
Title
(EN) SHEET PEELING APPARATUS AND SHEET PEELING METHOD
(FR) APPAREIL ET PROCEDE DE DECOLLEMENT DE FEUILLE
(JA) シート剥離装置及び剥離方法
Abstract
(EN) A sheet peeling apparatus (10) is provided with: a supporting means (11) which supports a semiconductor wafer (W) having an adhesive sheet (S) adhered thereon; a feeding means (12) which feeds a peeling tape (T); an adhering means (14) which adheres the peeling tape (T) on the adhesive sheet (S); a holding means (15) which holds the leading end of the peeling tape (T) in the feeding direction; and a peeling means (16) which applies a peeling force to the adhesive sheet (S).  The peeling means (16) includes a peeling roller (44), and the peeling roller (44) peels the adhesive sheet (S) in a state wherein the peeling roller abuts to the adhesive sheet from the adhesive layer side of the peeling tape (T) adhered on the adhesive sheet (S) and folds the peeling end section of the adhesive sheet (S) to form a folded section (c).
(FR) L'invention concerne un appareil de décollement de feuille (10) comprenant : un moyen de support (11) destiné à soutenir une plaquette semi-conductrice (W) sur laquelle est collée une feuille adhésive (S) ; un moyen d'acheminement (12) destiné à acheminer un ruban de décollement (T) ; un moyen d'adhérence (14) destiné à faire adhérer le ruban de décollement (T) sur la feuille adhésive (S) ; un moyen de maintien (15) destiné à maintenir l'extrémité avant du ruban de décollement (T) dans le sens d'acheminement ; ainsi qu'un moyen de décollement (16) destiné à appliquer une force de décollement sur la feuille adhésive (S). Le moyen de décollement (16) comprend un rouleau de décollement (44) destiné à décoller la feuille adhésive (S) dans un état dans lequel ledit rouleau est contigu à la feuille adhésive à partir du côté couche adhésive du ruban de décollement (T) collé sur la feuille adhésive (S) et plie la partie extrémité de décollement de la feuille adhésive (S) pour forme une partie pliée (c).
(JA)  接着シート(S)が貼付された半導体ウエハ(W)を支持する支持手段(11)と、剥離用テープ(T)を繰り出す繰出手段(12)と、剥離用テープ(T)を接着シート(S)に貼付する貼付手段(14)と、剥離用テープ(T)の繰出方向先端側を保持する保持手段(15)と、接着シート(S)に剥離力を付与する剥離手段(16)とを備えてシート剥離装置(10)が構成されている。剥離手段(16)は剥離用ローラ(44)を含み、当該剥離用ローラ(44)は、接着シート(S)に貼付された剥離用テープ(T)の接着剤層側から当接して接着シート(S)の剥離端部側を折り返して折り返し部(c)を形成した状態で接着シート(S)を剥離するようになっている。
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