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Machine translation
1. (WO2010024943) WAFER CARRIER WITH VARYING THERMAL RESISTANCE
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2010/024943    International Application No.:    PCT/US2009/004931
Publication Date: 04.03.2010 International Filing Date: 28.08.2009
IPC:
H01L 21/205 (2006.01), H01L 21/673 (2006.01), H01L 21/683 (2006.01), H01L 21/687 (2006.01)
Applicants: VEECO INSTRUMENTS INC. [US/US]; Terminal Drive Plainview, NY 11803 (US) (For All Designated States Except US).
VOLF, Boris [RU/US]; (US) (For US Only).
SODERMAN, Breid [US/US]; (US) (For US Only).
ARMOUR, Eric, A. [US/US]; (US) (For US Only)
Inventors: VOLF, Boris; (US).
SODERMAN, Breid; (US).
ARMOUR, Eric, A.; (US)
Agent: MILLET, Marcus, J.; Lerner, David, Littenberg, Krumholz & Mentlik, LLP 600 South Avenue West Westfield, NJ 07090 (US)
Priority Data:
61/190,494 29.08.2008 US
Title (EN) WAFER CARRIER WITH VARYING THERMAL RESISTANCE
(FR) SUPPORT DE PLAQUETTES À RÉSISTANCE THERMIQUE VARIABLE
Abstract: front page image
(EN)In chemical vapor deposition apparatus, a wafer carrier (32) has a top surface (34) holding the wafers and a bottom surface (36) heated by radiant heat transfer from a heating element (28). The bottom surface (36) of the wafer carrier is non-planar due to features such as depressions (54) so that the wafer carrier has different thickness at different locations. The thicker portions of the wafer carrier have higher thermal resistance. Differences in thermal resistance at different locations counteract undesired non-uniformities in heat transfer to the wafer. The wafer carrier may have pockets with projections (553, 853) for engaging spaced-apart locations on the edges of the wafer.
(FR)Dans un appareil de dépôt chimique en phase vapeur, un support de plaquettes (32) possède une surface supérieure (34) supportant les plaquettes et une surface inférieure (36) chauffée par transfert de chaleur radiant à partir d'un élément chauffant (28). La surface inférieure (36) du support de plaquettes est non plane en raison de caractéristiques telles que des creux (54) si bien que le support de plaquettes a différentes épaisseurs en différents endroits. Les parties plus épaisses du support de plaquettes ont une résistance thermique élevée. La différence de résistance thermique en différents endroits contrebalance les non-uniformités non souhaitées dans le transfert de chaleur vers la plaquette. Le support de plaquettes peut comporter des poches avec des saillies (553, 853) pour engager les emplacements espacés les uns des autres sur les arêtes de la plaquette.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)