WIPO logo
Mobile | Deutsch | Español | Français | 日本語 | 한국어 | Português | Русский | 中文 | العربية |
PATENTSCOPE

Search International and National Patent Collections
World Intellectual Property Organization
Search
 
Browse
 
Translate
 
Options
 
News
 
Login
 
Help
 
Machine translation
1. (WO2010024087) PHOTOSENSITIVE ADHESIVE COMPOSITION, AND FILM ADHESIVE, ADHESIVE SHEET, ADHESIVE PATTERN, SEMICONDUCTOR WAFER WITH ADHESIVE LAYER AND SEMICONDUCTOR DEVICE USING THE PHOTOSENSITIVE ADHESIVE COMPOSITION
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2010/024087    International Application No.:    PCT/JP2009/063585
Publication Date: 04.03.2010 International Filing Date: 30.07.2009
IPC:
C09J 201/00 (2006.01), C09J 4/00 (2006.01), C09J 7/00 (2006.01), C09J 7/02 (2006.01), C09J 11/06 (2006.01), C09J 163/00 (2006.01), C09J 179/08 (2006.01), G03F 7/004 (2006.01), G03F 7/037 (2006.01), H01L 21/52 (2006.01)
Applicants: HITACHI CHEMICAL COMPANY, LTD. [JP/JP]; 1-1, Nishi-Shinjuku 2-chome, Shinjuku-ku, Tokyo 1630449 (JP) (For All Designated States Except US).
MITSUKURA Kazuyuki [JP/JP]; (JP) (For US Only).
KAWAMORI Takashi [JP/JP]; (JP) (For US Only).
MASUKO Takashi [JP/JP]; (JP) (For US Only).
KATOGI Shigeki [JP/JP]; (JP) (For US Only)
Inventors: MITSUKURA Kazuyuki; (JP).
KAWAMORI Takashi; (JP).
MASUKO Takashi; (JP).
KATOGI Shigeki; (JP)
Agent: HASEGAWA Yoshiki; SOEI PATENT AND LAW FIRM Marunouchi MY PLAZA (Meiji Yasuda Life Bldg.) 9th fl. 1-1, Marunouchi 2-chome Chiyoda-ku, Tokyo 1000005 (JP)
Priority Data:
2008-218048 27.08.2008 JP
2009-068049 19.03.2009 JP
2009-095695 10.04.2009 JP
2009-105509 23.04.2009 JP
Title (EN) PHOTOSENSITIVE ADHESIVE COMPOSITION, AND FILM ADHESIVE, ADHESIVE SHEET, ADHESIVE PATTERN, SEMICONDUCTOR WAFER WITH ADHESIVE LAYER AND SEMICONDUCTOR DEVICE USING THE PHOTOSENSITIVE ADHESIVE COMPOSITION
(FR) COMPOSITION ADHÉSIVE PHOTOSENSIBLE, ET ADHÉSIF EN FILM, FEUILLE ADHÉSIVE, MOTIF ADHÉSIF, TRANCHE SEMI-CONDUCTRICE AVEC UNE COUCHE ADHÉSIVE ET DISPOSITIF SEMI-CONDUCTEUR EMPLOYANT LA COMPOSITION ADHÉSIVE PHOTOSENSIBLE
(JA) 感光性接着剤組成物、並びにそれを用いたフィルム状接着剤、接着シート、接着剤パターン、接着剤層付半導体ウェハ及び半導体装置
Abstract: front page image
(EN)A photosensitive adhesive composition having a minimum melt viscosity of not more than 30000 Pa·s as measured at 20 to 200°C after pattern formation.
(FR)L'invention concerne une composition adhésive photosensible dont la viscosité minimale à l'état fondu ne dépasse pas 30 000 Pa.s mesurée entre 20 et 200 °C après formation d'un motif.
(JA) パターン形成後の20℃~200℃における最低溶融粘度が30000Pa・s以下である感光性接着剤組成物。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)