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Machine translation
1. (WO2010023807) PANEL HAVING A CLEANING FUNCTION, AND METHOD FOR CLEANING A SUBSTRATE TREATMENT APPARATUS USING THE PANEL
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2010/023807    International Application No.:    PCT/JP2009/003224
Publication Date: 04.03.2010 International Filing Date: 10.07.2009
IPC:
B08B 1/00 (2006.01), H01L 21/027 (2006.01), H01L 21/304 (2006.01)
Applicants: NITTO DENKO CORPORATION [JP/JP]; 1-1-2, Shimohozumi, Ibaraki-shi, Osaka 5678680 (JP) (For All Designated States Except US).
MURATA, Akihisa [JP/JP]; (JP) (For US Only).
KONDO, Hiroyuki [JP/JP]; (JP) (For US Only)
Inventors: MURATA, Akihisa; (JP).
KONDO, Hiroyuki; (JP)
Agent: SHINJYU GLOBAL IP; South Forest Bldg., 1-4-19, Minamimori-machi, Kita-ku, Osaka-shi, Osaka 5300054 (JP)
Priority Data:
2008-220707 29.08.2008 JP
Title (EN) PANEL HAVING A CLEANING FUNCTION, AND METHOD FOR CLEANING A SUBSTRATE TREATMENT APPARATUS USING THE PANEL
(FR) PANNEAU À FONCTION NETTOYANTE ET PROCÉDÉ DE NETTOYAGE D’UN APPAREIL DE TRAITEMENT DE SUBSTRAT UTILISANT LEDIT PANNEAU
(JA) クリーニング機能付パネルおよびそれを用いた基板処理装置のクリーニング方法
Abstract: front page image
(EN)Disclosed is a method for cleaning a substrate treatment apparatus by passing a panel having cleaning function through the substrate treatment apparatus, so that the collection of a foreign matter and the excellent conveyance of the panel are made compatible.  The cleaning method is characterized in that a panel having cleaning function, which comprises a support, a cleaning member and a non-adhesive or poor-adhesive member, is passed through the substrate treatment apparatus.  The cleaning member is partially adhered to at lest one surface of the support, and has an adhesion of 0.10N /20 mm or higher (which is measured according to Testing Method of JIS Z0237 and under conditions of a peeling speed: 300 mm/minute and a peeling angle: 90 degrees with respect to a silicon mirror wafer).  The non-adhesive or poor-adhesive member is adhered to the remaining portion of the surface, to which the cleaning member has been adhered.
(FR)Cette invention concerne un procédé de nettoyage d’un appareil de traitement de substrat par passage d’un panneau à fonction nettoyante à travers l’appareil de traitement de substrat. L’invention permet de recueillir une matière étrangère tout en assurant un excellent acheminement du panneau. Le procédé de nettoyage est caractérisé en ce qu’un panneau à fonction nettoyante, comprenant un support, un élément nettoyant et un élément non adhésif ou faiblement adhésif, est acheminé à travers l’appareil de traitement de substrat. L’élément nettoyant adhère partiellement sur au moins une surface du support, sa force d’adhésion étant supérieure ou égale à 0,10 N/20 mm (ladite force est mesurée selon le procédé d’essai JIS Z0237, à une vitesse de pelage de 300 mm/minute et un angle de pelage de 90 degrés par rapport à une tranche de silicium polie). L’élément non adhésif ou faiblement adhésif est adhéré à la partie restante de la surface sur laquelle est adhéré l’élément nettoyant.
(JA)クリーニング機能付パネルを基板処理装置に通過させるクリーニング方法であって、異物の捕集性と前記クリーニング機能付パネルの良好な搬送性とを両立させた、クリーニング方法を提供することを課題とする。 [解決手段] 基板処理装置のクリーニング方法であって、 該基板処理装置に、  支持体と、  該支持体の少なくとも一方の表面上に部分的に貼付された、粘着力(該粘着力は、試験法JIS Z0237に準じ、対シリコンミラーウエハ、剥離速度:300mm/分、剥離角度:90°の条件で測定される。)が0.10N/20mm以上であるクリーニング部材と、  該クリーニング部材が貼付されている表面の残りの部分上に貼付された、非粘着性ないし微粘着性部材と、 を有するクリーニング機能付パネルを、 通過させることを特徴とするクリーニング方法。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)