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1. WO2010011841 - METAL NANOPARTICLE INK COMPOSITIONS

Publication Number WO/2010/011841
Publication Date 28.01.2010
International Application No. PCT/US2009/051543
International Filing Date 23.07.2009
IPC
C09D 11/02 2006.01
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
11Inks
02Printing inks
H01B 1/22 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
1Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
20Conductive material dispersed in non-conductive organic material
22the conductive material comprising metals or alloys
H05K 3/12 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
10in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
12using printing techniques to apply the conductive material
CPC
C09D 11/322
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
11Inks
30Inkjet printing inks
32characterised by colouring agents
322Pigment inks
C09D 11/52
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
11Inks
52Electrically conductive inks
H01B 1/22
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
1Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
20Conductive material dispersed in non-conductive organic material
22the conductive material comprising metals or alloys
H05K 1/097
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
09Use of materials for the ; conductive, e.g. ; metallic pattern
092Dispersed materials, e.g. conductive pastes or inks
097Inks comprising nanoparticles and specially adapted for being sintered at low temperature
H05K 2203/013
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2203Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
01Tools for processing; Objects used during processing
0104for patterning or coating
013Inkjet printing, e.g. for printing insulating material or resist
H05K 3/125
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
10in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
12using ; thick film techniques, e.g.; printing techniques to apply the conductive material ; or similar techniques for applying conductive paste or ink patterns
1241by ink-jet printing or drawing by dispensing
125by ink-jet printing
Applicants
  • METHODE ELECTRONICS, INC. [US]/[US] (AllExceptUS)
  • ST. JOHN, Frank [US]/[US] (UsOnly)
Inventors
  • ST. JOHN, Frank
Agents
  • WOLFE, Charles
Priority Data
61/083,62625.07.2008US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) METAL NANOPARTICLE INK COMPOSITIONS
(FR) COMPOSITIONS D’ENCRE À NANOPARTICULES MÉTALLIQUES
Abstract
(EN)
Nanoparticle inks which do not require further processing steps after application to a substrate in order to form a conductive or decorative pattern are described. The nanoparticle inks contain metal nanoparticles, one or more humectants, a dispersant and a solvent. Methods for forming the nanoparticle inks include a low energy mixing step and a high energy mixing step in order to form nanoparticle inks with the desired properties. Also described are cartridges comprising the nanoparticle inks which can be installed in standard printers.
(FR)
L’invention concerne des encres à nanoparticules qui ne nécessitent pas d’autres étapes de traitement après l’application à un substrat pour former un motif conducteur ou décoratif. Les encres à nanoparticules contiennent des nanoparticules métalliques, un ou plusieurs humectants, un dispersant et un solvant. Des procédés de formation des encres à nanoparticules comprennent une étape de mélange à faible énergie et une étape de mélange à haute énergie pour former des encres à nanoparticules avec les propriétés souhaitées. L’invention concerne également des cartouches qui comprennent les encres à nanoparticules qui peuvent être installées dans des imprimantes standard.
Latest bibliographic data on file with the International Bureau