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1. WO2010003036 - THIXOTROPIC CONDUCTIVE COMPOSITION

Publication Number WO/2010/003036
Publication Date 07.01.2010
International Application No. PCT/US2009/049472
International Filing Date 02.07.2009
IPC
C08K 3/36 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUSE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
3Use of inorganic substances as compounding ingredients
34Silicon-containing compounds
36Silica
C08K 3/04 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUSE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
3Use of inorganic substances as compounding ingredients
02Elements
04Carbon
C08K 3/08 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUSE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
3Use of inorganic substances as compounding ingredients
02Elements
08Metals
CPC
C08K 3/04
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUse of inorganic or non-macromolecular organic substances as compounding ingredients
3Use of inorganic substances as compounding ingredients
02Elements
04Carbon
C08K 3/08
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUse of inorganic or non-macromolecular organic substances as compounding ingredients
3Use of inorganic substances as compounding ingredients
02Elements
08Metals
C08K 3/36
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUse of inorganic or non-macromolecular organic substances as compounding ingredients
3Use of inorganic substances as compounding ingredients
34Silicon-containing compounds
36Silica
Applicants
  • HENKEL CORPORATION [US]/[US] (AllExceptUS)
  • YANG, Hui [CN]/[US] (UsOnly)
  • XIAO, Allison, Yue [US]/[US] (UsOnly)
  • WANG, Minghai [CN]/[CN] (UsOnly)
  • KONG, Hao [CN]/[CN] (UsOnly)
Inventors
  • YANG, Hui
  • XIAO, Allison, Yue
  • WANG, Minghai
  • KONG, Hao
Agents
  • GENNARO, Jane, E
Priority Data
61/077,89403.07.2008US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) THIXOTROPIC CONDUCTIVE COMPOSITION
(FR) COMPOSITION CONDUCTRICE THIXOTROPE
Abstract
(EN)
The presence of a rheology modifier in a conductive composition of metal coated core particles improves both rheology and conductivity. In preferred embodiments the rheology modifier is selected from the group consisting of fumed silica, carbon nano-tubes, and graphite. In further embodiments the metal coated particles are silver coated glass or copper particles.
(FR)
La présence d'un modificateur de rhéologie dans une composition conductrice de particules de noyau revêtues de métal améliore à la fois rhéologie et conductivité. Dans des modes de réalisation préférés, le modificateur de rhéologie est choisi dans le groupe consistant en la silice fumée, les nanotubes en carbone et le graphite. Dans des modes de réalisation supplémentaires, les particules revêtues de métal sont des particules de verre ou de cuivre revêtues d'argent.
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