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1. WO2010002832 - ABRASIVE SLICING TOOL FOR ELECTRONICS INDUSTRY

Publication Number WO/2010/002832
Publication Date 07.01.2010
International Application No. PCT/US2009/049158
International Filing Date 30.06.2009
IPC
B24D 3/04 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
DTOOLS FOR GRINDING, BUFFING OR SHARPENING
3Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
02the constituent being used as bonding agent
04and being essentially inorganic
B24D 3/06 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
DTOOLS FOR GRINDING, BUFFING OR SHARPENING
3Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
02the constituent being used as bonding agent
04and being essentially inorganic
06metallic
B24D 3/10 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
DTOOLS FOR GRINDING, BUFFING OR SHARPENING
3Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
02the constituent being used as bonding agent
04and being essentially inorganic
06metallic
10for porous or cellular structure, e.g. for use with diamonds as abrasives
CPC
B24D 3/06
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
DTOOLS FOR GRINDING, BUFFING, OR SHARPENING
3Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
02the constituent being used as bonding agent
04and being essentially inorganic
06metallic ; or mixture of metals with ceramic materials, e.g. hard metals, "cermets", cements
B24D 5/12
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
DTOOLS FOR GRINDING, BUFFING, OR SHARPENING
5Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor
12Cut-off wheels
Applicants
  • SAINT-GOBAIN ABRASIVES, INC. [US]/[US] (AllExceptUS)
  • SAINT-GOBAIN ABRASIFS [FR]/[FR] (AllExceptUS)
  • WALIA, Parul [IN]/[US] (UsOnly)
  • RAMANATH, Srinivasan [US]/[US] (UsOnly)
  • HALL, Richard, W. [GB]/[US] (UsOnly)
Inventors
  • WALIA, Parul
  • RAMANATH, Srinivasan
  • HALL, Richard, W.
Agents
  • TAYLOR, Anabela, Cristina
Priority Data
61/077,60402.07.2008US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) ABRASIVE SLICING TOOL FOR ELECTRONICS INDUSTRY
(FR) OUTIL ABRASIF DE DÉCOUPAGE EN TRANCHES POUR L'INDUSTRIE ÉLECTRONIQUE
Abstract
(EN)
A bond matrix for metal bonded abrasive tools includes a metal bond system, porosity and an optional filler. Tools according to embodiments of the invention exhibit long tool life, produce an acceptable quality of cut and can have self-dressing properties. The bond matrix can be used, for example, in abrasives tools configured for the electronics industry, such as 1A8 wheels for slicing ball grid arrays (BGAs) and other such slicing operations.
(FR)
L'invention porte sur une matrice d'adhésion pour outils abrasifs métalliques collés comprenant un système d'adhésion au métal et de renforcement de la porosité, et une remplisseuse facultative. Les outils conformes aux exécutions de l'invention présentent une longue durée de vie et une qualité acceptable de coupe, et peuvent avoir des propriétés d'autoaffutage. La matrice d'adhésion peut être utilisée, par exemple, dans des outils abrasifs configurés pour l'industrie d'électronique, tels que les roues 1A8 servant à découper les matrices de billes (BGAs) et à effectuer d'autres opérations de coupe analogues.
Also published as
PH12010502900
Latest bibliographic data on file with the International Bureau