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1. WO2010001727 - LASER ANNEALING DEVICE

Publication Number WO/2010/001727
Publication Date 07.01.2010
International Application No. PCT/JP2009/061016
International Filing Date 17.06.2009
IPC
H01L 21/268 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18the devices having semiconductor bodies comprising elements of group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
26Bombardment with wave or particle radiation
263with high-energy radiation
268using electromagnetic radiation, e.g. laser radiation
H01L 21/20 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18the devices having semiconductor bodies comprising elements of group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
20Deposition of semiconductor materials on a substrate, e.g. epitaxial growth
CPC
B23K 2103/56
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
2103Materials to be soldered, welded or cut
50Inorganic material, e.g. metals, not provided for in B23K2103/02B23K2103/26
56semiconducting
B23K 26/0853
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26Working by laser beam, e.g. welding, cutting or boring
08Devices involving relative movement between laser beam and workpiece
083Devices involving movement of the workpiece in at least one axial direction
0853Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
B23K 26/127
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26Working by laser beam, e.g. welding, cutting or boring
12in a special atmosphere, e.g. in an enclosure
127in an enclosure
B23K 26/128
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26Working by laser beam, e.g. welding, cutting or boring
12in a special atmosphere, e.g. in an enclosure
127in an enclosure
128Laser beam path enclosures
B23K 26/147
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26Working by laser beam, e.g. welding, cutting or boring
14using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
1462Nozzles; Features related to nozzles
1464Supply to, or discharge from, nozzles of media, e.g. gas, powder, wire
147Features outside the nozzle for feeding the fluid stream towards the workpiece
B23K 26/702
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26Working by laser beam, e.g. welding, cutting or boring
70Auxiliary operations or equipment
702Auxiliary equipment
Applicants
  • 株式会社IHI IHI Corporation [JP]/[JP] (AllExceptUS)
  • 河口 紀仁 KAWAGUCHI Norihito [JP]/[JP] (UsOnly)
  • 川上 隆介 KAWAKAMI Ryusuke [JP]/[JP] (UsOnly)
  • 西田 健一郎 NISHIDA Kenichiro [JP]/[JP] (UsOnly)
  • 伊澤 淳 IZAWA Jun [JP]/[JP] (UsOnly)
  • 正木 みゆき MASAKI Miyuki [JP]/[JP] (UsOnly)
  • 森田 勝 MORITA Masaru [JP]/[JP] (UsOnly)
Inventors
  • 河口 紀仁 KAWAGUCHI Norihito
  • 川上 隆介 KAWAKAMI Ryusuke
  • 西田 健一郎 NISHIDA Kenichiro
  • 伊澤 淳 IZAWA Jun
  • 正木 みゆき MASAKI Miyuki
  • 森田 勝 MORITA Masaru
Agents
  • 堀田 実 HOTTA Minoru
Priority Data
2008-17000730.06.2008JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) LASER ANNEALING DEVICE
(FR) DISPOSITIF DE RECUIT LASER
(JA) レーザアニール装置
Abstract
(EN)
Disclosed is a laser annealing device wherein uneven irradiation of laser light caused by refraction phenomenon of laser light due to temperature fluctuation of inert gas is reduced. A laser annealing device (1) comprises a gas supply unit (10) for supplying inert gas G at least to a laser irradiation region of a body (7) to be processed, and a gas temperature regulator (15) for regulating the temperature of the inert gas G.  The gas temperature regulator (15) regulates the temperature of the inert gas G being supplied to the laser irradiation region such that the temperature difference between the temperature of the inert gas G and the atmospheric temperature of a space (a room R) surrounding the optical path of laser light on the outside of the inert gas supply region is decreased.
(FR)
L'invention porte sur un dispositif de recuit laser dans lequel est réduit un rayonnement irrégulier de la lumière laser provoqué par un phénomène de réfraction de lumière laser dû à une fluctuation de température de gaz inerte. Le dispositif de recuit laser (1) consiste en une unité d'alimentation en gaz (10) destinée à alimenter un gaz inerte (G) au moins à une région d'irradiation laser d'un corps (7) à traiter ; et en un régulateur de température de gaz (15) destiné à réguler la température du gaz inerte (G). Le régulateur de température de gaz (15) régule la température du gaz inerte (G) alimenté à la région d'irradiation laser de telle sorte que la différence de température entre la température du gaz inerte (G) et la température atmosphérique d'un espace (une chambre R) entourant le trajet optique de lumière laser sur l'extérieur de la région d'alimentation en gaz inerte est diminuée.
(JA)
【課題】不活性ガスの温度のゆらぎによるレーザ光の屈折現象に起因するレーザ光の照射ムラを低減する。 【解決手段】レーザアニール装置1は、少なくとも被処理体7におけるレーザ照射領域に不活性ガスGを供給するガス供給装置10と、不活性ガスGの温度を調整するガス温調装置15とを備える。ガス温調装置15は、不活性ガスGの温度と、不活性ガスの供給領域の外側であってレーザ光の光路を囲む空間(部屋R)の雰囲気温度との温度差が小さくなるように、レーザ照射領域に供給される不活性ガスGの温度を調整する。
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