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Machine translation
1. (WO2009142630) STRAIN MEASUREMENT CHIPS FOR PRINTED CIRCUIT BOARDS
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2009/142630    International Application No.:    PCT/US2008/064292
Publication Date: 26.11.2009 International Filing Date: 21.05.2008
IPC:
H01L 29/84 (2006.01), G01L 1/00 (2006.01), H01L 29/78 (2006.01)
Applicants: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. [US/US]; 11445 Compaq Center Drive West Houston, TX 77070 (US) (For All Designated States Except US).
HOMER, Steven S. [US/US]; (US) (For US Only).
TRACY, Mark S. [US/US]; (US) (For US Only).
REDDIX, Kenneth D. [US/US]; (US) (For US Only).
RANKINS, Walter J. [US/US]; (US) (For US Only)
Inventors: HOMER, Steven S.; (US).
TRACY, Mark S.; (US).
REDDIX, Kenneth D.; (US).
RANKINS, Walter J.; (US)
Agent: HEWLETT-PACKARD COMPANY; Intellectual Property Administration Mail Stop 35 P.O. Box 272400 Fort Collins, CO 80527-2400 (US)
Priority Data:
Title (EN) STRAIN MEASUREMENT CHIPS FOR PRINTED CIRCUIT BOARDS
(FR) PUCES D'EXTENSOMÉTRIE POUR CARTES DE CIRCUIT IMPRIMÉ
Abstract: front page image
(EN)A strain measurement chip including a body, a strain gauge provided within the body, and electrical contacts with which the strain measurement chip can be mounted to a circuit board, at least one of the electrical contacts being in electrical communication with the strain gauge to enable communication of stain data measured by the strain gauge to the circuit board.
(FR)L'invention porte sur une puce d'extensométrie comprenant un corps, un extensomètre installé dans le corps, et des contacts électriques avec lesquels la puce d'extensométrie peut être montée sur une carte de circuit, au moins l'un des contacts électriques étant en communication électrique avec l'extensomètre pour permettre une communication de données de déformation mesurées par l'extensomètre à la carte de circuit.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, SV, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MT, NL, NO, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)