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1. (WO2009142107) ONE-PART CURABLE COMPOSITION
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2009/142107    International Application No.:    PCT/JP2009/058540
Publication Date: 26.11.2009 International Filing Date: 23.04.2009
IPC:
C08F 4/40 (2006.01), C08F 16/12 (2006.01), C08F 20/06 (2006.01)
Applicants: THREE BOND CO., LTD. [JP/JP]; 1456, Hazama-cho Hachioji-shi Tokyo 193-0941 (JP) (For All Designated States Except US).
SUZUKI, Hironori [JP/JP]; (JP) (For US Only).
MAFUNE, Hitoshi [JP/JP]; (JP) (For US Only)
Inventors: SUZUKI, Hironori; (JP).
MAFUNE, Hitoshi; (JP)
Agent: SAITO, Takehiko; Akasaka Grace Bldg., 3-6, Akasaka 1-chome, Minato-ku, Tokyo 1070052 (JP)
Priority Data:
2008-135873 23.05.2008 JP
Title (EN) ONE-PART CURABLE COMPOSITION
(FR) COMPOSITION DURCISSABLE SIMPLE
(JA) 一液硬化型組成物
Abstract: front page image
(EN)Disclosed is a composition comprising (A) a compound having one or more polymerizable double bonds in the molecule, (B) a hydroperoxide compound, and (C) an organic rhodium complex as the essential components. The composition has high storage stability and can provide a cured resin when heated at a low temperature for a short period.
(FR)La présente invention concerne une composition comprenant (A) un composé qui présente une ou plusieurs liaisons doubles polymérisables dans la molécule, (B) un composé d'hydroperoxyde, et (C) un complexe de rhodium organique en tant que composants essentiels. Ladite composition présente une grande stabilité au stockage et peut fournir une résine durcie lorsqu'elle est chauffée à basse température pendant une courte période.
(JA)(A)1分子中に重合性二重結合を1以上もつ化合物、(B)ハイドロパーオキサイド化合物及び(C)有機ロジウム錯体を必須成分として含む組成物は保存安定性が高く、低温で短時間の加熱で硬化樹脂を与えることができる。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)