WIPO logo
Mobile | Deutsch | Español | Français | 日本語 | 한국어 | Português | Русский | 中文 | العربية |

Search International and National Patent Collections
World Intellectual Property Organization
Machine translation
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2009/142107    International Application No.:    PCT/JP2009/058540
Publication Date: 26.11.2009 International Filing Date: 23.04.2009
C08F 4/40 (2006.01), C08F 16/12 (2006.01), C08F 20/06 (2006.01)
Applicants: THREE BOND CO., LTD. [JP/JP]; 1456, Hazama-cho Hachioji-shi Tokyo 193-0941 (JP) (For All Designated States Except US).
SUZUKI, Hironori [JP/JP]; (JP) (For US Only).
MAFUNE, Hitoshi [JP/JP]; (JP) (For US Only)
Inventors: SUZUKI, Hironori; (JP).
MAFUNE, Hitoshi; (JP)
Agent: SAITO, Takehiko; Akasaka Grace Bldg., 3-6, Akasaka 1-chome, Minato-ku, Tokyo 1070052 (JP)
Priority Data:
2008-135873 23.05.2008 JP
(JA) 一液硬化型組成物
Abstract: front page image
(EN)Disclosed is a composition comprising (A) a compound having one or more polymerizable double bonds in the molecule, (B) a hydroperoxide compound, and (C) an organic rhodium complex as the essential components. The composition has high storage stability and can provide a cured resin when heated at a low temperature for a short period.
(FR)La présente invention concerne une composition comprenant (A) un composé qui présente une ou plusieurs liaisons doubles polymérisables dans la molécule, (B) un composé d'hydroperoxyde, et (C) un complexe de rhodium organique en tant que composants essentiels. Ladite composition présente une grande stabilité au stockage et peut fournir une résine durcie lorsqu'elle est chauffée à basse température pendant une courte période.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)