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Machine translation
1. (WO2009141413) PRINTED CIRCUIT BOARD WITH CO-PLANAR PLATE AND METHOD OF MANUFACTURING THEREFOR
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2009/141413    International Application No.:    PCT/EP2009/056199
Publication Date: 26.11.2009 International Filing Date: 21.05.2009
IPC:
H05K 1/02 (2006.01)
Applicants: NUJIRA LIMITED [GB/GB]; Building 1010 Cambourne Business Park Cambourne Cambridge Cambridge CB23 6DP (GB) (For All Designated States Except US).
TRU-LON PRINTED CIRCUITS (ROYSTON) LIMITED [GB/GB]; c/o HW Associates Portmill Lane Hitchin Hertfordshire SG4 1DJ (GB) (For All Designated States Except US).
GEE, Timothy, Edward [GB/GB]; (GB) (For US Only).
SHARPLES, Richard [GB/GB]; (GB) (For US Only)
Inventors: GEE, Timothy, Edward; (GB).
SHARPLES, Richard; (GB)
Agent: WILLIAMS, David, John; (GB)
Priority Data:
0809270.2 21.05.2008 GB
Title (EN) PRINTED CIRCUIT BOARD WITH CO-PLANAR PLATE AND METHOD OF MANUFACTURING THEREFOR
(FR) CARTE DE CIRCUIT IMPRIMÉ À PLAQUE COPLANAIRE ET PROCÉDÉ DE FABRICATION ASSOCIÉ
Abstract: front page image
(EN)There is disclosed a method of forming a printed circuit board including a plate for providing thermal conductivity from an upper surface of the printed circuit board to a lower surface of the printed circuit board, the method comprising the steps of: providing an opening in the printed circuit board extending from the upper surface to the lower surface; providing a raised portion on the plate having dimensions corresponding to the opening in the printed circuit board, the height of said raised portion being greater than the thickness of the printed circuit board; laminating the printed circuit board and the metal plate to form the raised portion of the plate in the opening of the printed circuit board; and compressing the laminated structure to form a structure in which the upper surface of the printed circuit board is coplanar with the surface of the raised portion of the metal plate.
(FR)Cette invention se rapporte à un procédé pour former une carte de circuit imprimé qui comprend une plaque destinée à fournir une conductivité thermique à partir de la surface supérieure de la carte de circuit imprimé vers la surface inférieure de la carte de circuit imprimé, le procédé comprenant les étapes consistant à : fournir une ouverture dans la carte de circuit imprimé qui s'étend de la surface supérieure vers la surface inférieure; fournir une partie en relief sur la plaque dont les dimensions correspondent à celles de l'ouverture dans la carte de circuit imprimé, la hauteur de ladite partie en relief étant plus grande que l'épaisseur de la carte de circuit imprimé; stratifier la carte de circuit imprimé et la plaque métallique de manière à former la partie en relief de la plaque dans l'ouverture de la carte de circuit imprimé; et comprimer la structure stratifiée de manière à former une structure dans laquelle la surface supérieure de la carte de circuit imprimé est coplanaire avec la surface de la partie en relief de la plaque métallique.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)