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1. (WO2009140798) ELECTRONIC COMPONENT PACKAGE BODY AND ITS PACKAGING METHOD
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2009/140798    International Application No.:    PCT/CN2008/001145
Publication Date: 26.11.2009 International Filing Date: 13.06.2008
IPC:
H01L 21/60 (2006.01), H01L 21/56 (2006.01), H01L 23/485 (2006.01)
Applicants: XINTEC INC. [CN/CN]; 4F., No. 25, Jilin Rd. Jhongli Taoyuan County 320 Taiwan 32062 (CN) (For All Designated States Except US).
TSAI, Chia-Lun [CN/CN]; (CN) (For US Only).
CHIEN, Wen-Cheng [CN/CN]; (CN) (For US Only).
LEE, Po-Han [CN/CN]; (CN) (For US Only).
CHEN, Wei-Ming [CN/CN]; (CN) (For US Only).
LIU, Chien-Hung [CN/CN]; (CN) (For US Only).
WEN, Ying-Nan [CN/CN]; (CN) (For US Only)
Inventors: TSAI, Chia-Lun; (CN).
CHIEN, Wen-Cheng; (CN).
LEE, Po-Han; (CN).
CHEN, Wei-Ming; (CN).
LIU, Chien-Hung; (CN).
WEN, Ying-Nan; (CN)
Agent: LINDA LIU & PARTNERS; F16 Tower C, Beijing Global Trade Center 36 North Third Ring East Road, Dongcheng District Beijing 100013 (CN)
Priority Data:
61/128,358 21.05.2008 US
Title (EN) ELECTRONIC COMPONENT PACKAGE BODY AND ITS PACKAGING METHOD
(FR) CORPS DE BOÎTIER DE COMPOSANT ÉLECTRONIQUE ET SON PROCÉDÉ DE MISE EN BOÎTIER
(ZH) 电子元件封装体及其制作方法
Abstract: front page image
(EN)An electronic component package body (100) comprises a wafer (300) with a first surface (S1) and a second surface (S2) opposite to the first surface (S1) and a groove (113) extending from the second surface (S2) to the first surface (S1) and entering the wafer (300) body. At least two contact holes (113a) are provided in the bottom of the groove (113). Also included is a packaging method for the electronic component package body.
(FR)La présente invention concerne un corps de boîtier de composant électronique (100) qui comprend une tranche (300) dotée d’une première surface (S1) et d’une seconde surface (S2) située à l’opposé de la première surface (S1) ainsi qu’une dépression (113) s’étendant de la seconde surface (S2) à la première surface (S1) et entrant dans le corps de tranche (300). Au moins deux orifices de contact (113a) sont prévus dans la partie inférieure de la dépression (113). La présente invention concerne également le procédé de mise en boîtier du corps de boîtier de composant électronique.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, SV, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MT, NL, NO, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: Chinese (ZH)
Filing Language: Chinese (ZH)