WIPO logo
Mobile | Deutsch | Español | Français | 日本語 | 한국어 | Português | Русский | 中文 | العربية |
PATENTSCOPE

Search International and National Patent Collections
World Intellectual Property Organization
Search
 
Browse
 
Translate
 
Options
 
News
 
Login
 
Help
 
Machine translation
1. (WO2009140238) STRUCTURE AND METHOD FOR RELIABLE SOLDER JOINTS
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2009/140238    International Application No.:    PCT/US2009/043549
Publication Date: 19.11.2009 International Filing Date: 12.05.2009
IPC:
H01L 21/60 (2006.01), H01L 23/48 (2006.01)
Applicants: TEXAS INSTRUMENTS INCORPORATED [US/US]; P.O. Box 655474 Mail Station 3999 Dallas, TX 75265-5474 (US) (For All Designated States Except US).
ZENG, Kejun [CN/US]; (US) (For US Only).
DUNNE, Rajiv [IN/US]; (US) (For US Only).
MURTUZA, Masood [US/US]; (US) (For US Only)
Inventors: ZENG, Kejun; (US).
DUNNE, Rajiv; (US).
MURTUZA, Masood; (US)
Agent: FRANZ, Warren L.; (US)
Priority Data:
61/052,499 12.05.2008 US
12/463,517 11.05.2009 US
Title (EN) STRUCTURE AND METHOD FOR RELIABLE SOLDER JOINTS
(FR) STRUCTURE ET PROCÉDÉ POUR DES JOINTS DE BRASAGE FIABLES
Abstract: front page image
(EN)A solder joint (200) has a first contact pad (114) and a second contact pad (124) of a first metal, preferably copper, facing each other across a gap. A coat (115 and 125, respectively) of a second metal, preferably nickel, covers each pad. A layer (201) of crystals of first intermetallic compounds, such as Ni3Sn4 and (Ni, Cu)3Sn4, covers the surface of each coat. Isolated crystals (202) of second intermetallic compounds, such as Cu6Sn5 and (Cu, Ni)6Sn5, different from the first intermetallic compounds, are dispersed on top of the layer of crystals of the first intermetallic compounds. A solder alloy (203) including a third metal, preferably tin, and the first metal fills the gap. The solder alloy may further include a fourth metal, preferably selected from a group of metals including silver, zinc, and indium.
(FR)Selon l’invention, un joint de brasage (200) possède un premier plot de contact (114) et un second plot de contact (124) d'un premier métal, de préférence le cuivre, tournés l'un vers l'autre à travers un intervalle. Un revêtement (respectivement 115 et 125) d'un second métal, de préférence le nickel, recouvre chaque plot. Une couche (201) de cristaux de premiers composés intermétalliques, tels que Ni3Sn4 et (Ni, Cu)3Sn4, recouvre la surface de chaque revêtement. Des cristaux isolés (202) de seconds composés intermétalliques, tels que Cu6Sn5 et (Cu, Ni)6Sn5, différents des premiers composés intermétalliques, sont dispersés sur la partie supérieure de la couche de cristaux des premiers composés intermétalliques. Un alliage de brasage (203) comprenant un troisième métal, de préférence l'étain, et le premier métal remplit l'intervalle. L'alliage de brasage peut en outre comprendre un quatrième métal, de préférence choisi dans un groupe de métaux comprenant l'argent, le zinc et l'indium.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)