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Machine translation
1. (WO2009140153) APPARATUS FOR ETCHING SEMICONDUCTOR WAFERS
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2009/140153    International Application No.:    PCT/US2009/043261
Publication Date: 19.11.2009 International Filing Date: 08.05.2009
IPC:
H01L 21/683 (2006.01), H01L 21/687 (2006.01), H01L 21/3065 (2006.01), H01L 21/205 (2006.01)
Applicants: APPLIED MATERIALS, INC. [US/US]; P.O. Box 450A Santa Clara, CA 95052 (US) (For All Designated States Except US).
LUBOMIRSKY, Dmitry [IL/US]; (US) (For US Only).
TAN, Tien, Fak [SG/US]; (US) (For US Only).
TSUEI, Lun [CN/US]; (US) (For US Only)
Inventors: LUBOMIRSKY, Dmitry; (US).
TAN, Tien, Fak; (US).
TSUEI, Lun; (US)
Agent: CATMULL, Kelvin, B.; (US)
Priority Data:
12/121,599 15.05.2008 US
Title (EN) APPARATUS FOR ETCHING SEMICONDUCTOR WAFERS
(FR) APPAREIL DE GRAVURE DE PLAQUETTES DE SEMI-CONDUCTEURS
Abstract: front page image
(EN)A wafer pedestal of a semiconductor apparatus is provided. The wafer pedestal is capable of supporting a substrate. The wafer pedestal includes a pedestal having at least one purge opening configured to flow a purge gas and at least one chucking opening configured to chuck the substrate over the pedestal. The pedestal includes a sealing band disposed between the at least one purge opening and the at least one chucking opening. The sealing band is configured to support the substrate.
(FR)La présente invention concerne un support de plaquettes d'un appareil à semi-conducteurs. Le support de plaquettes peut supporter un substrat. Le support de plaquettes comprend un support ayant au moins une ouverture d'évacuation conçue pour faire circuler un gaz d'évacuation et au moins une ouverture de retenue conçue pour retenir le substrat sur le support. Le support comprend une bande d'étanchéité disposée entre ladite au moins une ouverture d'évacuation et ladite au moins une ouverture de retenue. La bande d'étanchéité est conçue pour supporter le substrat.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)