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Machine translation
1. (WO2009140050) ELECTRONIC ASSEMBLIES WITHOUT SOLDER AND METHOD FOR THEIR DESIGN, PROTOTYPING, AND MANUFACTURE
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2009/140050    International Application No.:    PCT/US2009/041835
Publication Date: 19.11.2009 International Filing Date: 27.04.2009
IPC:
H05K 13/04 (2006.01), H05K 3/30 (2006.01)
Applicants: OCCAM PORTFOLIO LLC [US/US]; 20400 Stevens Creek Blvd., 5th Floor Cupertino, CA 95014 (US) (For All Designated States Except US).
FJELSTAD, Joseph, C. [US/US]; (US) (For US Only).
GAMINI, Nader [US/US]; (US) (For US Only).
TICHANE, David [US/US]; (US) (For US Only)
Inventors: FJELSTAD, Joseph, C.; (US).
GAMINI, Nader; (US).
TICHANE, David; (US)
Agent: TICHANE, David; (US)
Priority Data:
12/119,287 12.05.2008 US
61/075,238 24.06.2008 US
12/163,870 27.06.2008 US
12/170,426 09.07.2008 US
12/182,043 29.07.2008 US
12/184,086 31.07.2008 US
12/187,323 06.08.2008 US
12/191,544 14.08.2008 US
12/200,749 28.08.2008 US
12/410,362 24.03.2009 US
12/405,773 17.03.2009 US
12/429,988 24.04.2009 US
Title (EN) ELECTRONIC ASSEMBLIES WITHOUT SOLDER AND METHOD FOR THEIR DESIGN, PROTOTYPING, AND MANUFACTURE
(FR) ENSEMBLES ÉLECTRONIQUES SANS SOUDURE ET PROCÉDÉS DE CONCEPTION, DE PROTOTYPAGE ET DE FABRICATION DE CES DERNIERS
Abstract: front page image
(EN)A system for prototyping electrical circuits, as well as creating production circuits, without using solder. Stand-in electrical components 110a are placed on a carrier 100a and scanned 310. From the resulting data, a machine tool or laser ablation system 410 then creates a negative master 420a with aperture(s) 530 into which production components 810 are placed and secured. Component leads 820 or packages are encapsulated with electrically insulating material 910 with vias 1030a exposing the leads. Traces 1040 connect appropriate leads forming a circuit sub-assembly 1000 which can serve as a basis for a circuit assembly formed through a reverse-interconnection process.
(FR)L'invention porte sur un système qui permet d'effectuer un prototypage de circuits électriques et de créer des circuits de production sans utiliser de soudure. Selon l'invention, on place des composants électriques de substitution (110a) sur un support (100a) et on les soumet à un balayage (310). A partir des données obtenues, une machine-outil ou un système d'ablation au laser (410) peut alors créer un maître négatif (420a) percé d'une ou plusieurs ouvertures (530) dans lesquelles on place et on fixe les composants de production (810). On encapsule les fils de connexion (820) ou les boîtiers dans un matériau électriquement isolant (910) pourvu de trous de connexion (1030a) qui exposent les fils. Des tracés (1040) relient les fils de connexion appropriés, formant un sous-ensemble de circuit (100) qui peut servir de base à un ensemble circuit qui sera formé par un processus d'interconnexion inverse.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)