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Machine translation
1. (WO2009139773) FLEXIBLE CIRCUIT SEAL
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2009/139773    International Application No.:    PCT/US2008/063619
Publication Date: 19.11.2009 International Filing Date: 15.05.2008
IPC:
B41J 2/16 (2006.01), B41J 2/045 (2006.01)
Applicants: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. [US/US]; 11445 Compaq Center Drive West Houston, TX 77070 (US) (For All Designated States Except US).
MORROW, Michael M. [US/US]; (US) (For US Only).
HOLAVARRI, Jay [US/US]; (US) (For US Only).
PETERSEN, Daniel W. [US/US]; (US) (For US Only)
Inventors: MORROW, Michael M.; (US).
HOLAVARRI, Jay; (US).
PETERSEN, Daniel W.; (US)
Agent: MYERS, Timothy F.; Hewlett-Packard Company, Intellectual Property Administration, Mail Stop 35, P.O. Box 272400, Fort Collins, Colorado 80527-2400 (US)
Priority Data:
Title (EN) FLEXIBLE CIRCUIT SEAL
(FR) JOINT POUR CIRCUIT FLEXIBLE
Abstract: front page image
(EN)Various embodiments and methods relating to an adhesive paste layer (34, 134) sandwiched between a flexible circuit (30) and a fluid delivery system (26) to form a seal at least partially about a print head (28) are disclosed.
(FR)L'invention se rapporte à divers modes de réalisation et procédés concernant une couche de pâte adhésive (34, 134) intercalée entre un circuit flexible (30) et un système de délivrance de liquide (26) pour former un joint au moins partiellement autour de la tête d'impression (28).
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, SV, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MT, NL, NO, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)