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1. (WO2009139584) ADHESIVE COMPOSITION, ADHESIVE SHEET, AND BACK GRINDING METHOD FOR SEMICONDUCTOR WAFER
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2009/139584    International Application No.:    PCT/KR2009/002559
Publication Date: 19.11.2009 International Filing Date: 14.05.2009
IPC:
C09J 7/02 (2006.01)
Applicants: LG CHEM, LTD. [KR/KR]; 20, Yoido-dong, Youngdungpo-gu Seoul 150-721 (KR) (For All Designated States Except US).
KIM, Se Ra [KR/KR]; (KR) (For US Only).
BAEK, Yoon Jeong [KR/KR]; (KR) (For US Only).
KIM, Jang Soon [KR/KR]; (KR) (For US Only).
LEE, Jae Gwan [KR/KR]; (KR) (For US Only).
PARK, Hyun Woo [KR/KR]; (KR) (For US Only)
Inventors: KIM, Se Ra; (KR).
BAEK, Yoon Jeong; (KR).
KIM, Jang Soon; (KR).
LEE, Jae Gwan; (KR).
PARK, Hyun Woo; (KR)
Agent: DANA PATENT LAW FIRM; 501, BYC Bldg., 648-1 Yeoksam-dong, Kangnam-gu Seoul 135-080 (KR)
Priority Data:
10-2008-0044494 14.05.2008 KR
Title (EN) ADHESIVE COMPOSITION, ADHESIVE SHEET, AND BACK GRINDING METHOD FOR SEMICONDUCTOR WAFER
(FR) COMPOSITION ADHÉSIVE, FEUILLE ADHÉSIVE, ET PROCÉDÉ D'AFFÛTAGE DU DOS DESTINÉ À UN SEMICONDUCTEUR ÉTAGÉ
(KO) 점착제 조성물, 점착 시트 및 반도체 웨이퍼 이면연삭 방법
Abstract: front page image
(EN)The present invention relates to an adhesive composition containing a polymer of a monomer mixture comprising an isobornyl (meta)acrylate, an adhesive sheet, and a back grinding method for a semiconductor wafer. The present invention employs an isobornyl (meta)acrylate which is a hard-type monomer and has a low hydrophilicity, thus providing an adhesive composition with excellent water resistance, peeling properties, re-peelability and wettability to a wafer, as well as an adhesive sheet manufactured by using the composition and a back grinding method using the same.
(FR)L'invention concerne une composition adhésive contenant un polymère d'un mélange de monomères qui comprend un (méta)acrylate d'isobornyle, une feuille adhésive, et un procédé d'affûtage du dos destiné à un semiconducteur étagé. Cette invention utilise un (méta)acrylate d'isobornyle qui consiste en un monomère du type dur et qui possède un faible caractère hydrophile, produisant ainsi une composition adhésive à résistance à l'eau, à propriétés de décollement et de recollement et à mouillabilité excellentes sur une tranche, ainsi qu'une feuille adhésive fabriquée à partir de cette composition et un procédé d'affûtage du dos utilisant cette dernière.
(KO)본 발명은 이소보닐 (메타)아크릴레이트를 포함하는 단량체 혼합물의 중합체를 함유하는 점착제 조성물, 점착 시트 및 반도체 웨이퍼의 이면연삭 방법에 관한 것이다. 본 발명에서는 하드 타입의 단량체이면서, 낮은 친수성을 가지는 이소보닐 (메타)아크릴레이트를 사용함으로써, 탁월한 내수성을 나타내면서도, 박리 특성, 재박리성 및 웨이퍼로의 젖음성이 우수한 점착제 조성물, 상기를 사용하여 제조된 점착 시트 및 이를 사용한 이면연삭 방법을 제공할 수 있다.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: Korean (KO)
Filing Language: Korean (KO)