WIPO logo
Mobile | Deutsch | Español | Français | 日本語 | 한국어 | Português | Русский | 中文 | العربية |
PATENTSCOPE

Search International and National Patent Collections
World Intellectual Property Organization
Search
 
Browse
 
Translate
 
Options
 
News
 
Login
 
Help
 
Machine translation
1. (WO2009139335) PHOTOSENSITIVE RESIN COMPOSITION
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2009/139335    International Application No.:    PCT/JP2009/058704
Publication Date: 19.11.2009 International Filing Date: 08.05.2009
IPC:
G03F 7/023 (2006.01), C08K 5/41 (2006.01), C08L 77/06 (2006.01), G03F 7/40 (2006.01), H01L 21/027 (2006.01)
Applicants: ASAHI KASEI E-MATERIALS CORPORATION [JP/JP]; 1-105, Kanda Jinbocho, Chiyoda-ku, Tokyo 1018101 (JP) (For All Designated States Except US).
SASAKI, Takahiro [JP/JP]; (JP) (For US Only).
TANIZAKI, Yoko [JP/JP]; (JP) (For US Only)
Inventors: SASAKI, Takahiro; (JP).
TANIZAKI, Yoko; (JP)
Agent: AOKI, Atsushi; (JP)
Priority Data:
2008-125788 13.05.2008 JP
Title (EN) PHOTOSENSITIVE RESIN COMPOSITION
(FR) COMPOSITION DE RÉSINE PHOTOSENSIBLE
(JA) 感光性樹脂組成物
Abstract: front page image
(EN)Disclosed is a photosensitive resin composition which is characterized by comprising: (a) 100 parts by mass of a polyamide having a structure represented by general formula (1) [wherein each substituent and others are as defined in the scope of claims]; and (b) 1 to 100 parts by mass of a diazoquinone compound represented by general formula (2) [wherein each substituent and others are as defined in the scope of claims].
(FR)La présente invention concerne une composition de résine photosensible qui est caractérisée en ce qu'elle comprend : (a) 100 parties en masse d'un polyamide présentant une structure représentée par la formule générale (1) [dans laquelle chaque substituant et d'autres sont définis dans la portée des revendications]; et (b) 1 à 100 parties en masse d'un composé de diazoquinone représenté par la formule générale (2) [dans laquelle chaque substituant et d'autres sont définis dans la portée des revendications].
(JA)(a)下記一般式(1):{式中、各置換基等は請求項に定義するものである。}で表される構造を有するポリアミド100質量部、及び(b)下記一般式(2):{式中、各置換基等は請求項に定義するものである。}で表されるジアゾキノン化合物1~100質量部、 を含むことを特徴とする感光性樹脂組成物。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)