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1. (WO2009137764) CMP PAD THICKNESS AND PROFILE MONITORING SYSTEM
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2009/137764    International Application No.:    PCT/US2009/043288
Publication Date: 12.11.2009 International Filing Date: 08.05.2009
IPC:
H01L 21/304 (2006.01), B24B 37/04 (2012.01)
Applicants: APPLIED MATERIALS, INC. [US/US]; 3050 Bowers Avenue Santa Clara, CA 95054 (US) (For All Designated States Except US).
MANENS, Antoine, P. [FR/US]; (US) (For US Only).
HSU, Wei-yung [CN/US]; (US) (For US Only).
M'SAAD, Hichem [US/US]; (US) (For US Only)
Inventors: MANENS, Antoine, P.; (US).
HSU, Wei-yung; (US).
M'SAAD, Hichem; (US)
Agent: PATTERSON, B., Todd; (US)
Priority Data:
61/051,634 08.05.2008 US
Title (EN) CMP PAD THICKNESS AND PROFILE MONITORING SYSTEM
(FR) SYSTÈME DE SURVEILLANCE DE PROFIL ET D’ÉPAISSEUR DE TAMPON CMP
Abstract: front page image
(EN)In one embodiment a method is provided for maintaining a substrate processing surface. The method generally includes performing a set of measurements on the substrate processing surface, wherein the set of measurements are taken using a displacement sensor coupled to a processing surface conditioning arm, determining a processing surface profile based on the set of measurements, comparing the processing surface profile to a minimum profile threshold, and communicating a result of the profile comparison.
(FR)L’invention concerne, dans un mode de réalisation, un procédé pour maintenir une surface de traitement de substrat. Le procédé comprend généralement la réalisation d’un ensemble de mesures sur la surface de traité de substrat, l’ensemble de mesures étant pris à l’aide d’un capteur de déplacement couplé à un bras de conditionnement de surface de traitement, la détermination d’un profil de surface de traitement basé sur l’ensemble de mesures, la comparaison du profil de surface de traitement à un seuil de profil minimal, et la communication d’un résultat de la comparaison de profil.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)