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Machine translation
1. (WO2009136716) PRESS FORGED METAL HOUSING FOR LEDS AND AN LED METAL PACKAGE USING THE METAL HOUSING
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2009/136716    International Application No.:    PCT/KR2009/002347
Publication Date: 12.11.2009 International Filing Date: 04.05.2009
IPC:
H01L 33/00 (2010.01), H01L 33/48 (2010.01), H01L 33/60 (2010.01), H01L 33/64 (2010.01)
Applicants: YOON, Sung No [KR/KR]; (KR).
KIM, Min Kong [KR/KR]; (KR)
Inventors: YOON, Sung No; (KR).
KIM, Min Kong; (KR)
Agent: SESHIN PATENT & LAW FIRM; #207, World Meridian Venture Center II 426-5, Gasan-dong, Geumcheon-gu Seoul 153-781 (KR)
Priority Data:
10-2008-0041641 06.05.2008 KR
Title (EN) PRESS FORGED METAL HOUSING FOR LEDS AND AN LED METAL PACKAGE USING THE METAL HOUSING
(FR) LOGEMENT MÉTALLIQUE FORGÉ À LA PRESSE POUR LED ET BOÎTIER MÉTALLIQUE POUR LED UTILISANT LE LOGEMENT MÉTALLIQUE
(KO) 프레스 단조 방식의 발광다이오드 금속제 하우징 및 금속제 하우징을 이용한 발광다이오드 금속제 패키지
Abstract: front page image
(EN)Disclosed are an LED (Light Emitting Diode) metal housing produced by press forging according to the present invention and an LED metal package using the metal housing, wherein the LED housing comprises a housing body having a chip mount part formed on a central portion of the top surface to receive one or more LED chips therein, and a reflective protrusion integrally formed outside the chip mount part on the top surface of the housing body, the integrated housing body and reflective protrusion being made out of a metallic material.  By forming the housing body where one or more LED chips are mounted and the reflective protrusion from a metallic material, the present invention makes it possible to unify and standardize the volume (size) of LED housings.  Advantages of standardized LED housings include automatic mounting of LED chips, automatic connection of electrode lines between LED chips and terminals, automatic mounting of an external terminal and an increase in automated operation rate of a series of resin (casting resin or silicon) coating processes.  These result in an improved yield and reduced material costs.  Moreover, the housing and reflective protrusion formed from a metallic material can not only increase the illuminance on a reflection surface and further the luminance of an optical element package, but also prevent luminance degradation and utilizes LED-generated light in an efficient way.
(FR)L'invention concerne un logement métallique pour LED (diodes électroluminescentes) produit par forgeage à la presse selon la présente invention et un boîtier métallique pour LED utilisant le logement métallique, le logement pour LED comportant un corps de logement doté d’une partie de montage de composants formée sur une région centrale de sa surface supérieure afin d’y recevoir un ou plusieurs composants à LED, et une protubérance réfléchissante formé de façon intégrée à l’extérieur de la partie de montage de composants sur la surface supérieure du corps de logement, le corps de logement et la protubérance réfléchissante intégrés étant constitués d’un matériau métallique. En formant le corps de logement où sont montés un ou plusieurs composants à LED et la protubérance réfléchissante à partir d’un matériau métallique, la présente invention permet d’unifier et de standardiser le volume (l’encombrement) des logements pour LED. Parmi les avantages des logements pour LED standardisés, on peut citer le montage automatique des composants à LED, le raccordement automatique des fils d’électrodes entre les composants à LED et les bornes, le montage automatique d’une borne extérieure et un accroissement du rythme d’exploitation automatisée d’une série de processus de revêtement à la résine (résine de moulage ou silicium). Cela se traduit par un rendement amélioré et des coûts matière réduits. En outre, le logement et la protubérance réfléchissante formés d’un matériau métallique peuvent non seulement augmenter l’illumination sur une surface de réflexion ainsi que la luminance d’un boîtier d’élément optique, mais également empêcher la dégradation de la luminance et utiliser la lumière générée par les LED de manière efficiente.
(KO)본 발명에 다른 프레스 단조방식으로 제조된 발광다이오드 금속제 하우징 및 금속제 하우징을 이용한 발광다이오드 금속제 패키지는, 하나 이상의 발광다이오드 (LED:LIGHT EMITTING DIODE)칩이 상면 중앙부에 형성된 칩장착부에 장착되는 하우징바디와 상기 하우징바디의 상면에서 칩장착부의 외측에 형성되는 반사돌부를 일체로 형성하되, 상기일체로 형성되는 하우징바디를 반사돌부를 금속재질로 형성하여서 된 것이다. 본 발명은, 하나 이상의 발광다이오드 (LED:LIGHT EMITTING DIODE)칩이 장착되는 하우징바디와 반사돌부를 금속제로 형성함으로써 발광다이오드 하우징은 체적 (크기)을 균일하게 하여 규격화할 수 있고, 발광다이오드 하우징을 규격화함으로써 발광다이오드 칩을 자삽 (자동 장착)하고 발광다이오드 칩과 단자간에 전극선을 자동으로 연결할 수가 있으며 외부단자를 자동으로 장착할 수 있으며 수지 (캐스팅 수지 혹은 실리콘)를 도포하는 일련의 공정 자동화 가동률을 높일 수 있으며, 따라서 생산성을 높일 수 있어서 원가를 절감할 수 있고 하우징과 반사돌부를 금속제로 형성함으로써 반사면의 조도를 높여 광소자패키지의 휘도를 향상시킬 수 있을 뿐만 아니라 금속재료로 되어 있어서 휘도저하가 발생하지 않으며 발광다이오드에서 발생하는 빛을 효율적으로 활용할 수 있다.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: Korean (KO)
Filing Language: Korean (KO)