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Machine translation
1. (WO2009135078) METHOD AND APPARATUS FOR FABRICATING OPTOELECTROMECHANICAL DEVICES BY STRUCTURAL TRANSFER USING RE-USABLE SUBSTRATE
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2009/135078    International Application No.:    PCT/US2009/042431
Publication Date: 05.11.2009 International Filing Date: 30.04.2009
IPC:
H01L 31/042 (2006.01)
Applicants: THE REGENTS OF THE UNIVERSITY OF CALIFORNIA [US/US]; 1111 Franklin Street Twelfth Floor Oakland, CA 94607-5200 (US) (For All Designated States Except US).
JAYARAMAN, Logeeswaran, Veerayah [MY/US]; (US) (For US Only).
KATZENMEYER, Aaron, M. [US/US]; (US) (For US Only).
ISLAM, M., Saif [BD/US]; (US) (For US Only)
Inventors: JAYARAMAN, Logeeswaran, Veerayah; (US).
KATZENMEYER, Aaron, M.; (US).
ISLAM, M., Saif; (US)
Agent: YAO, Shun; (US)
Priority Data:
61/049,041 30.04.2008 US
Title (EN) METHOD AND APPARATUS FOR FABRICATING OPTOELECTROMECHANICAL DEVICES BY STRUCTURAL TRANSFER USING RE-USABLE SUBSTRATE
(FR) PROCÉDÉ ET APPAREIL DE FABRICATION DE DISPOSITIFS OPTO-ÉLECTROMÉCANIQUES PAR TRANSFERT DE STRUCTURE AVEC UTILISATION D’UN SUBSTRAT RÉUTILISABLE
Abstract: front page image
(EN)One embodiment of the present invention provides a process for fabricating multiple devices on a single substrate based on a structure transfer process. During operation, the process starts by forming structures of multiple devices on a first substrate. The process then bonds the structures of the multiple devices onto a second substrate. Next, the process transfers the multiple devices from the first substrate onto the second substrate by fracturing the structures of the multiple devices off the first substrate, wherein the transferred devices preserve physical orientation and material properties of the said fabricated structures.
(FR)Cette invention concerne, selon un mode de réalisation, un procédé de fabrication d’une pluralité de dispositifs sur un seul substrat basé sur un procédé de transfert de structure. A l’usage, le procédé comprend les étapes consistant à : former les structures de plusieurs dispositifs sur un premier substrat; coller ensuite les structures des multiples dispositifs sur un second substrat; transférer ensuite les multiples dispositifs du premier au second substrat en séparant du premier substrat. Dans ledit procédé, les dispositifs transférés préservent l’orientation physique et les propriétés matérielles desdites structures fabriquées.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)