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Machine translation
1. (WO2009134689) ROBUST METAL FILM ENCAPSULATION
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2009/134689    International Application No.:    PCT/US2009/041664
Publication Date: 05.11.2009 International Filing Date: 24.04.2009
IPC:
H01M 2/26 (2006.01)
Applicants: INFINITE POWER SOLUTIONS, INC. [US/US]; 11149 Bradford Road Littleton, CO 80127 (US) (For All Designated States Except US).
SNYDER, Shawn, W. [US/US]; (US) (For US Only).
BRANTNER, Paul, C. [US/US]; (US) (For US Only).
KEATING, Joseph, A. [US/US]; (US) (For US Only).
BRADOW, Timothy, N. [US/US]; (US) (For US Only).
NARAYAN, Prativadi, B. [US/US]; (US) (For US Only).
NEUDECKER, Bernd, J. [DE/US]; (US) (For US Only)
Inventors: SNYDER, Shawn, W.; (US).
BRANTNER, Paul, C.; (US).
KEATING, Joseph, A.; (US).
BRADOW, Timothy, N.; (US).
NARAYAN, Prativadi, B.; (US).
NEUDECKER, Bernd, J.; (US)
Agent: SCHWARTZ, Jeff, E.; Dewey & Leboeuf LLP 1101 New York Avenue NW Washington, DC 20005 (US)
Priority Data:
12/111,388 29.04.2008 US
Title (EN) ROBUST METAL FILM ENCAPSULATION
(FR) ENCAPSULATION SOUS FILM MÉTALLIQUE ROBUSTE
Abstract: front page image
(EN)The present invention relates to metal film encapsulation of an electrochemical device. The metal film encapsulation may provide contact tabs for the electrochemical device. The present invention may also include a selectively conductive bonding layer between a contact and a cell structure. The present invention may further include ways of providing heat and pressure resilience to the bonding layer and improving the robustness of the protection for the cell structure.
(FR)La présente invention porte sur une encapsulation sous film métallique d'un dispositif électrochimique. L'encapsulation sous film métallique peut fournir des pattes de contact pour le dispositif électrochimique. La présente invention peut également comprendre une couche de liaison sélectivement conductrice entre un contact et une structure de cellule. La présente invention peut en outre comprendre des façons de conférer de la résilience thermique et à la pression à la couche de liaison et d'améliorer la robustesse de la protection pour la structure de cellule.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)