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1. (WO2009134011) SEMICONDUCTOR CHIP AND LIQUID CRYSTAL PANEL IN LCD MODULE, THE LCD MODULE, A METHOD FOR CONNECTING THEM AND A METHOD FOR CONFIRMING THE CONNECTION
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2009/134011    International Application No.:    PCT/KR2009/001548
Publication Date: 05.11.2009 International Filing Date: 26.03.2009
IPC:
G02F 1/1345 (2006.01)
Applicants: SILICON WORKS CO., LTD [KR/KR]; 104-13, Munji-dong Yuseong-gu Daejeon-si 305-380 (KR) (For All Designated States Except US).
SEO, Jung Il [KR/KR]; (KR) (For US Only).
JUNG, Yong Icc [KR/KR]; (KR) (For US Only).
NA, Joon Ho [KR/KR]; (KR) (For US Only).
KIM, Dae Seong [KR/KR]; (KR) (For US Only)
Inventors: SEO, Jung Il; (KR).
JUNG, Yong Icc; (KR).
NA, Joon Ho; (KR).
KIM, Dae Seong; (KR)
Agent: LEE, Cheol Hee; (KR)
Priority Data:
10-2008-0039271 28.04.2008 KR
Title (EN) SEMICONDUCTOR CHIP AND LIQUID CRYSTAL PANEL IN LCD MODULE, THE LCD MODULE, A METHOD FOR CONNECTING THEM AND A METHOD FOR CONFIRMING THE CONNECTION
(FR) PUCE À SEMICONDUCTEUR ET PANNEAU À CRISTAUX LIQUIDES DANS UN MODULE D'AFFICHAGE À CRISTAUX LIQUIDES, MODULE D'AFFICHAGE À CRISTAUX LIQUIDES, PROCÉDÉ DE CONNEXION DE CES DERNIERS ET PROCÉDÉ PERMETTANT DE CONFIRMER LA CONNEXION
(KO) 액정 표시 모듈 내의 반도체 칩과 액정 패널, 액정 표시 모듈, 및 이들의 연결 방법과 연결 확인 방법
Abstract: front page image
(EN)This invention discloses a semiconductor chip and a liquid crystal panel in an LCD module and methods for connecting them and confirming the connection. The LCD module includes: a semiconductor chip including at least two primary adhesive test pads, and a conductive film that is connected between the primary adhesive test pads; and a liquid crystal panel including secondary adhesive test pads that adhere to the primary adhesive test pads, and glass-substrate lines connected to the secondary adhesive test pads. The semiconductor chip is attached to the liquid crystal panel as a COG (chip-on- glass) or COF (chip-on-film).
(FR)L'invention concerne une puce à semiconducteur, un panneau à cristaux liquides dans un module d'affichage à cristaux liquides (LCD) et des procédés permettant de les connecter et de confirmer la connexion. Le module LCD précité comprend: au moins deux plages d'essai adhésives principales; des plages d'essai adhésives secondaires qui adhèrent aux plages d'essai adhésives principales; et un panneau à cristaux liquides comprenant des lignes de substrat en verre reliées aux plages d'essai adhésives secondaires. La puce à semiconducteur est attachée au panneau à cristaux liquides sous la forme d'une puce sur verre ou COG (Chip On the Glass) ou d'une puce sur film ou COF (Chip On the Film).
(KO)본 발명은 액정 표시 모듈 내의 반도체 칩과 액정 패널, 이들의 연결 방법 및 연결 확인 방법에 대하여 개시된다. 액정 표시 모듈은, 적어도 2개 이상의 제1 접착 검사용 패드들 및 제1 접착 검사용 패드들 사이에 연결되는 도전막을 포함하는 반도체 칩과, 제1 접착 검사용 패드들과 접착하는 제2 접착 검사용 패드들 및 제2 접착 검사용 패드들과 연결되는 유리 기판 라인들을 포함하는 액정 패널로 구성된다. 반도체 칩은 COG(Chip On the Glass) 타입 또는 COF(Chip On the Flim) 타입으로 액정 패널에 붙여진다.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: Korean (KO)
Filing Language: Korean (KO)