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Machine translation
1. (WO2009133901) CIRCUIT CONNECTING MATERIAL, FILM-LIKE ADHESIVE, ADHESIVE REEL, AND CIRCUIT CONNECTING STRUCTURAL BODY
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2009/133901    International Application No.:    PCT/JP2009/058392
Publication Date: 05.11.2009 International Filing Date: 28.04.2009
IPC:
H05K 1/14 (2006.01), C09J 4/00 (2006.01), C09J 9/02 (2006.01), C09J 201/00 (2006.01), H01B 1/20 (2006.01), H01B 5/16 (2006.01), H01R 11/01 (2006.01)
Applicants: HITACHI CHEMICAL COMPANY, LTD. [JP/JP]; 1-1, Nishi-Shinjuku 2-chome, Shinjuku-ku, Tokyo 1630449 (JP) (For All Designated States Except US).
HONDA, Tomoyasu [JP/JP]; (JP) (For US Only).
FUJINAWA, Tohru [JP/JP]; (JP) (For US Only).
HORIUCHI, Takeshi [JP/JP]; (JP) (For US Only).
YANAGAWA Toshiyuki [JP/JP]; (JP) (For US Only)
Inventors: HONDA, Tomoyasu; (JP).
FUJINAWA, Tohru; (JP).
HORIUCHI, Takeshi; (JP).
YANAGAWA Toshiyuki; (JP)
Agent: HASEGAWA Yoshiki; SOEI PATENT AND LAW FIRM Marunouchi MY PLAZA (Meiji Yasuda Life Bldg.) 9th fl. 1-1, Marunouchi 2-chome Chiyoda-ku, Tokyo 1000005 (JP)
Priority Data:
2008-117196 28.04.2008 JP
2009-003403 09.01.2009 JP
Title (EN) CIRCUIT CONNECTING MATERIAL, FILM-LIKE ADHESIVE, ADHESIVE REEL, AND CIRCUIT CONNECTING STRUCTURAL BODY
(FR) MATÉRIAU DE CONNEXION DE CIRCUIT, ADHÉSIF DE TYPE FILM, BOBINE ADHÉSIVE, ET CORPS STRUCTURAL DE CONNEXION DE CIRCUIT
(JA) 回路接続材料、フィルム状接着剤、接着剤リール及び回路接続構造体
Abstract: front page image
(EN)Provided is a circuit connecting material (20) which electrically connects a pair of facing circuit electrodes by applying a pressure to the circuit electrodes in a direction wherein the circuit electrodes face each other, by arranging the circuit connecting material between the pair of circuit electrodes. The circuit connecting material contains an adhesive composition (21) and a filler (22) dispersed in the adhesive composition (21), and the content of the filer (22) is 1-25 vol%.
(FR)L'invention concerne un matériau de connexion de circuit (20) qui connecte électriquement une paire d'électrodes de circuit orientées l'une en face de l'autre par application d'une pression sur les électrodes du circuit dans un sens dans lequel les électrodes du circuit sont orientées l'une en face de l'autre, par disposition du matériau de connexion de circuit entre la paire d'électrodes de circuit. Le matériau de connexion de circuit contient une composition adhésive (21) et une matière de remplissage (22) dispersée dans la composition adhésive (21); la teneur en matière de remplissage (22) étant de 1-25 vol%.
(JA) 本発明の回路接続材料は、対向配置された一対の回路電極の間に介在させて、一対の回路電極を対向する方向に加圧することによって一対の回路電極を電気的に接続する回路接続材料20であって、接着剤組成物21と接着剤組成物21中に分散された充填剤22とを含有し、充填剤22の含有量が1~25体積%である。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)