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1. (WO2009131788) THREE-DIMENSIONAL SYSTEM AND METHOD FOR CONNECTED COMPONENT LABELING

Pub. No.:    WO/2009/131788    International Application No.:    PCT/US2009/038243
Publication Date: Oct 29, 2009 International Filing Date: Mar 25, 2009
IPC: G06F 9/44
G06F 9/00
Applicants: EYEP, INC.
SULLENDER, Craig
Inventors: SULLENDER, Craig
Title: THREE-DIMENSIONAL SYSTEM AND METHOD FOR CONNECTED COMPONENT LABELING
Abstract:
Embodiments disclosed include methods and systems for three dimensional connected component labeling, including determining a location value for each of one or more labels, each location value identifying a maximum "y" extent and a maximum "z" extent of an associated label region; storing each of the one or more labels that refer to areas subsumed in a determination of the maximum y extent in the maximum "z" extent as a yzMax location value; buffering in a frame buffer the one or more of labels; and providing access via a three-dimensional kernel to one or more values in a current line buffer and/or a current array and/or a previous array.