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1. (WO2009131433) OPTOMECHANICAL PLATFORM FOR OPTOELECTRONICS PACKAGING
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2009/131433    International Application No.:    PCT/MY2009/000055
Publication Date: 29.10.2009 International Filing Date: 20.04.2009
IPC:
G02B 6/12 (2006.01), G02B 6/42 (2006.01), G02B 5/00 (2006.01)
Applicants: MIMOS BERHAD [MY/MY]; Technology Park of Malaysia, Bukit Jalil, 57000 Kuala Lumpur (MY) (For All Designated States Except US).
WONG, Seck, Jiong [MY/MY]; (MY) (For US Only).
GUNAWAN, Witjaksono [ID/MY]; (MY) (For US Only)
Inventors: WONG, Seck, Jiong; (MY).
GUNAWAN, Witjaksono; (MY)
Agent: MOHAN, K.; Adastra Intellectual Property Sdn Bhd, P.O. Box 43, Suite 2B, Level 7, Menara Dato Onn, Putra World Trade Centre, 45, Jalan Tun Ismail, 50480 Kuala Lumpur (MY)
Priority Data:
PI 20081209 22.04.2008 MY
Title (EN) OPTOMECHANICAL PLATFORM FOR OPTOELECTRONICS PACKAGING
(FR) PLATE-FORME OPTOMÉCANIQUE POUR BOÎTIER D’OPTOÉLECTRONIQUE
Abstract: front page image
(EN)An optomechanical platform (10) comprises a receptacle (11), cylindrical in shape with designed-in features capable of positioning all attached devices and components accurately where assembly adjustments are passive and requires no further alignments. The optomechanical platform (10) includes independent thermal dissipation capability for supporting multiple optical (18) and optoelectronic devices (12).
(FR)Plate-forme optomécanique (10), comprenant un logement (11) de forme cylindrique doté d’éléments intégrés susceptibles d’assurer le positionnement précis de tous les dispositifs et composants qui y sont fixés, les ajustements d’assemblage étant passifs et aucune autre opération d’alignement n’étant requise. La plate-forme optomécanique (10) possède une propriété de dissipation thermique indépendante permettant la prise en charge de multiples dispositifs optiques (18) et optoélectroniques (12).
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)