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1. (WO2009131101) CONDUCTIVE RESIN COMPOSITION

Pub. No.:    WO/2009/131101    International Application No.:    PCT/JP2009/057871
Publication Date: Oct 29, 2009 International Filing Date: Apr 20, 2009
IPC: C08L 63/00
C08G 59/42
C08K 3/08
C08K 5/1515
C08K 5/1539
C08K 5/56
C08K 9/02
C09J 9/02
C09J 11/04
C09J 11/06
C09J 163/00
H01B 1/22
Applicants: THREE BOND CO., LTD.
株式会社スリーボンド
SUZUKI, Hironori
鈴木 宏則
MAFUNE, Hitoshi
真舩 仁志
Inventors: SUZUKI, Hironori
鈴木 宏則
MAFUNE, Hitoshi
真舩 仁志
Title: CONDUCTIVE RESIN COMPOSITION
Abstract:
Disclosed is a conductive resin composition which can secure sufficient reliability in reliability test even when a low-cost conductive powder is used. The conductive resin composition can be suitably used for conductive adhesives and the like. The conductive resin composition contains the following components (A)-(D). Component (A): an epoxy resin Component (B): an acid anhydride Component (C): an organic metal complex containing titanium and/or zirconium Component (D): a nickel powder and/or a silver powder