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Machine translation
1. (WO2009130737) SUBSTRATE FOR INSPECTION, METHOD FOR MANUFACTURING SUBSTRATE FOR INSPECTION, AND INSPECTION METHOD USING THE SUBSTRATE FOR INSPECTION
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2009/130737    International Application No.:    PCT/JP2008/001037
Publication Date: 29.10.2009 International Filing Date: 21.04.2008
IPC:
G01R 1/073 (2006.01), G01R 31/28 (2006.01)
Applicants: FUJITSU LIMITED [JP/JP]; 1-1, Kamikodanaka 4-chome, Nakahara-ku, Kawasaki-shi, Kanagawa, 2118588 (JP) (For All Designated States Except US).
SHIOGA, Takeshi [JP/JP]; (JP) (For US Only).
KURIHARA, Kazuaki [JP/JP]; (JP) (For US Only)
Inventors: SHIOGA, Takeshi; (JP).
KURIHARA, Kazuaki; (JP)
Agent: TAKAHASHI, Keishiro; TAKAHASHI & KITAYAMA 4th Fl., Okachimachi, Tohsei Bldg., 3-12-1, Taito, Taito-ku, Tokyo 1100016 (JP)
Priority Data:
Title (EN) SUBSTRATE FOR INSPECTION, METHOD FOR MANUFACTURING SUBSTRATE FOR INSPECTION, AND INSPECTION METHOD USING THE SUBSTRATE FOR INSPECTION
(FR) SUBSTRAT POUR INSPECTION, PROCÉDÉ DE FABRICATION D’UN SUBSTRAT POUR INSPECTION ET PROCÉDÉ D’INSPECTION UTILISANT LE SUBSTRAT POUR INSPECTION
(JA) 検査用基板、検査用基板の製造方法、及びその検査用基板を用いた検査方法
Abstract: front page image
(EN)On a surface of a substrate, a plurality of recessed sections are formed. The respective inner surfaces of the recessed sections are covered with electrically conductive films. The electrically conductive films are brought into contact with the bumps of a semiconductor element under inspection and are connected electrically with the bumps. This prevents the bumps from being damaged due to contact with a probe needle.
(FR)La présente invention concerne un substrat dont la surface comporte une pluralité de sections en creux. Les surfaces intérieures respectives des sections en creux sont recouvertes de films électriquement conducteurs. Les films électriquement conducteurs sont mis en contact avec les bosses d’un élément semi-conducteur soumis à une inspection et sont reliés électriquement aux bosses. Ceci empêche un endommagement des bosses au cours du contact avec une aiguille de sonde.
(JA) 基板の一方の表面に複数の凹部が形成されている。凹部の各々の内面を、導電膜が覆う。この導電膜が、被検査半導体素子のバンプに接触して、該バンプに電気的に接続される。これにより、プローブ針を接触させることによって生ずるバンプのダメージを防止することができる。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, SV, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MT, NL, NO, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)