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1. (WO2009128886) MANUFACTURING APPARATUS FOR DEPOSITING A MATERIAL AND AN ELECTRODE FOR USE THEREIN

Pub. No.:    WO/2009/128886    International Application No.:    PCT/US2009/002289
Publication Date: Oct 22, 2009 International Filing Date: Apr 13, 2009
IPC: F28F 13/18
C23C 16/44
C01B 33/035
Applicants: HEMLOCK SEMICONDUCTOR CORPORATION
DEHTIAR, Max
HILLABRAND, David
KNAPP, Theodore
MCCOY, Keith
MOLNAR, Michael
Inventors: DEHTIAR, Max
HILLABRAND, David
KNAPP, Theodore
MCCOY, Keith
MOLNAR, Michael
Title: MANUFACTURING APPARATUS FOR DEPOSITING A MATERIAL AND AN ELECTRODE FOR USE THEREIN
Abstract:
The present invention relates to a manufacturing apparatus for deposition of a material on a carrier body and an electrode for use with the manufacturing apparatus. Typically, the carrier body has a first end and a second end spaced from each other. A socket is disposed at each of the end of the carrier body. The apparatus includes a housing that defines a chamber. At least one electrode is disposed through the housing for receiving the socket. The electrode includes an interior surface that defines a channel. The electrode heats the carrier body to a necessary deposition temperature by direct passage of electrical current to the carrier body. A coolant is in fluid communication with the channel of the electrode for reducing the temperature of the electrode. A channel coating is disposed in the interior surface of the electrode for preventing loss of heat transfer between the coolant and the interior surface.