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1. (WO2009125764) METHACRYLIC RESIN COMPOSITION FOR HOT PLATE MELT-BONDING, USE OF THE SAME FOR HOT PLATE MELT-BONDING, AND MELT-BONDING METHOD
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2009/125764 International Application No.: PCT/JP2009/057127
Publication Date: 15.10.2009 International Filing Date: 07.04.2009
IPC:
C08L 33/12 (2006.01) ,F21S 8/10 (2006.01)
Applicants: WAKE, Takao[JP/JP]; JP (UsOnly)
YAMAZAKI, Kazuhiro[JP/JP]; JP (UsOnly)
SUMITOMO CHEMICAL COMPANY, LIMITED[JP/JP]; 27-1, Shinkawa 2-chome, Chuo-ku, Tokyo 1048260, JP (AllExceptUS)
Inventors: WAKE, Takao; JP
YAMAZAKI, Kazuhiro; JP
Agent: HASEGAWA, Yoshiki; SOEI PATENT AND LAW FIRM, Marunouchi MY PLAZA (Meiji Yasuda Life Bldg.) 9th fl., 1-1, Marunouchi 2-chome, Chiyoda-ku, Tokyo 1000005, JP
Priority Data:
2008-10024708.04.2008JP
Title (EN) METHACRYLIC RESIN COMPOSITION FOR HOT PLATE MELT-BONDING, USE OF THE SAME FOR HOT PLATE MELT-BONDING, AND MELT-BONDING METHOD
(FR) COMPOSITION DE RÉSINE MÉTHACRYLIQUE POUR COLLAGE THERMOFUSIBLE DE PLAQUES, SON UTILISATION POUR LE COLLAGE THERMOFUSIBLE DE PLAQUES, ET PROCÉDÉ DE COLLAGE THERMOFUSIBLE
(JA) 熱板融着用メタクリル樹脂組成物、熱板融着への使用及び融着方法
Abstract:
(EN) Disclosed is use of a methacrylic resin composition for hot plate melt-bonding, wherein the methacrylic resin composition comprises a polymer produced by the bulk polymerization of a monomer mainly composed of methyl methacrylate.
(FR) Cette invention concerne l'utilisation d'une composition de résine méthacrylique pour le collage thermofusible de plaques, la composition de résine méthacrylique comprenant un polymère produit par polymérisation en masse d'un monomère principalement composé de méthacrylate de méthyle.
(JA)  メタクリル酸メチルを主体とする単量体が塊状重合してなる重合体を含有するメタクリル樹脂組成物の熱板融着への使用。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (EPO) (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)