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1. (WO2009124243) DIE THINNING PROCESSES AND STRUCTURES
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2009/124243    International Application No.:    PCT/US2009/039450
Publication Date: 08.10.2009 International Filing Date: 03.04.2009
IPC:
H01L 21/68 (2006.01), H01L 21/00 (2006.01), H01L 21/683 (2006.01)
Applicants: THE CHARLES STARK DRAPER LABORATORY, INC. [US/US]; 555 Technology Square Cambridge, MA 02139-3563 (US) (For All Designated States Except US).
THOMPSON, Jeffrey, C. [US/US]; (US) (For US Only).
TEPOLT, Gary, B. [US/US]; (US) (For US Only).
RACZ, Livia, M. [US/US]; (US) (For US Only)
Inventors: THOMPSON, Jeffrey, C.; (US).
TEPOLT, Gary, B.; (US).
RACZ, Livia, M.; (US)
Agent: RADCLIFFE, Kenneth, E.; (US).
FAIRCHILD, Brian, A.; (US).
BLASI, Robert, S.; (US).
CURRIE, Matthew, T.; (US).
DAVIS, Chad, E.; (US)
Priority Data:
12/062,864 04.04.2008 US
Title (EN) DIE THINNING PROCESSES AND STRUCTURES
(FR) PROCÉDÉS ET STRUCTURES D’AMINCISSEMENT DE PUCE
Abstract: front page image
(EN)Microelectronic dies are thinned from a first thickness tl to a second thickness t2 according to a variety of approaches, which may include bonding the dies (110) to a substrate (200) under vacuum, disposing a film (120) over the dies and the substrate, and/or changing a center of pressure during thinning. The film (120) acts as a polishing stop.
(FR)Selon l’invention, des puces microélectroniques sont amincies selon une diversité d’approches, qui peuvent inclure la liaison des puces à un substrat sous vide, le dépôt d’un film sur les puces et le substrat et/ou le changement d’un centre de pression pendant l’amincissement.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)