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Machine translation
1. (WO2009123818) SEMICONDUCTOR STRUCTURE
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2009/123818 International Application No.: PCT/US2009/036074
Publication Date: 08.10.2009 International Filing Date: 04.03.2009
Chapter 2 Demand Filed: 29.01.2010
IPC:
H01L 23/525 (2006.01)
Applicants: TUTEN, Derrick[US/US]; US (UsOnly)
CAVE, David, L.[US/US]; US (UsOnly)
DOLPAN AUDIO, LLC[US/US]; 160 Greentree Drive Suite 101 Dover, DE 19904, US (AllExceptUS)
Inventors: TUTEN, Derrick; US
CAVE, David, L.; US
Agent: HART, Daniel; US
Priority Data:
12/080,12631.03.2008US
Title (EN) SEMICONDUCTOR STRUCTURE
(FR) STRUCTURE DE SEMI-CONDUCTEURS
Abstract: front page image
(EN) A fusible link between metallization layers of a semiconductor device comprising a tungsten plug (131) deposited in a via interconnecting two aluminum metallization layers (107a, 103a).
(FR) La présente invention concerne une liaison fusible entre des couches de métallisation d'un dispositif à semi-conducteurs comprenant une fiche de tungstène (131) déposée dans un trou de raccordement reliant deux couches de métallisation d'aluminium (107a, 103a).
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (EPO) (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)