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1. (WO2009123159) COPPER ALLOY MATERIAL FOR ELECTRIC AND ELECTRONIC APPARATUSES, AND ELECTRIC AND ELECTRONIC COMPONENTS

Pub. No.:    WO/2009/123159    International Application No.:    PCT/JP2009/056576
Publication Date: Oct 8, 2009 International Filing Date: Mar 30, 2009
IPC: C22C 9/06
C22F 1/08
H01B 1/02
H01L 23/48
C22F 1/00
H01B 13/00
Applicants: THE FURUKAWA ELECTRIC CO., LTD.
古河電気工業株式会社
SATO, Koji
佐藤 浩二
HIROSE, Kiyoshige
廣瀬 清慈
KANEKO, Hiroshi
金子 洋
Inventors: SATO, Koji
佐藤 浩二
HIROSE, Kiyoshige
廣瀬 清慈
KANEKO, Hiroshi
金子 洋
Title: COPPER ALLOY MATERIAL FOR ELECTRIC AND ELECTRONIC APPARATUSES, AND ELECTRIC AND ELECTRONIC COMPONENTS
Abstract:
Provided is a copper alloy material for electric and electronic apparatuses. The copper alloy material contains a Ni of 3.3 mass% or more but not more than 5.0 mass%, Si within a range of 2.8-3.8 in mass ratio of Ni to Si (Ni/Si), a Mg of 0.01-0.2 mass%, a Sn of 0.05-1.5 mass%, a Zn of 0.2-1.5 mass% and the rest is composed of Cu and unavoidable impurities. The material does not break when a test piece, which has a thickness (t) of 0.20 mm and a width (w) of 2.0 mm, is subjected to 90° W-bending with a bend radius of 0.1mm. Electric and electronic components manufactured by processing such copper alloy material are also provided.