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1. (WO2009122878) ENERGY RAY-CURABLE POLYMER, ENERGY RAY-CURABLE PRESSURE SENSITIVE ADHESIVE COMPOSITION, PRESSURE-SENSITIVE ADHESIVE SHEET AND METHOD OF PROCESSING SEMICONDUCTOR WAFER

Pub. No.:    WO/2009/122878    International Application No.:    PCT/JP2009/054742
Publication Date: Oct 8, 2009 International Filing Date: Mar 12, 2009
IPC: C08F 220/10
C09J 7/02
C09J 201/02
H01L 21/304
Applicants: LINTEC Corporation
リンテック株式会社
MAEDA, Jun
前田 淳
TANAKA, Keiko
田中 圭子
Inventors: MAEDA, Jun
前田 淳
TANAKA, Keiko
田中 圭子
Title: ENERGY RAY-CURABLE POLYMER, ENERGY RAY-CURABLE PRESSURE SENSITIVE ADHESIVE COMPOSITION, PRESSURE-SENSITIVE ADHESIVE SHEET AND METHOD OF PROCESSING SEMICONDUCTOR WAFER
Abstract:
In a pressure-sensitive adhesive composition or a pressure-sensitive adhesive sheet containing an energy ray-curable polymer, problems associated with the volatilization of a low-molecular weight compound contained in the composition are overcome. An energy ray-curable polymer characterized by comprising a radical-generating group, which is capable of initiating a polymerization reaction upon excitation with an energy ray, and an energy ray-polymerizable group bonded together in the main or side chain.