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1. (WO2009119634) FIXING MATERIAL COMPRISING SILANE COMPOUND POLYMER AND PHOTONIC DEVICE SEALED BODY

Pub. No.:    WO/2009/119634    International Application No.:    PCT/JP2009/055895
Publication Date: Oct 1, 2009 International Filing Date: Mar 25, 2009
IPC: C08G 77/26
H01L 23/29
H01L 23/31
H01L 33/56
Applicants: LINTEC Corporation
リンテック株式会社
TAMADA, Takashi
玉田 高
KASHIO, Mikihiro
樫尾 幹広
Inventors: TAMADA, Takashi
玉田 高
KASHIO, Mikihiro
樫尾 幹広
Title: FIXING MATERIAL COMPRISING SILANE COMPOUND POLYMER AND PHOTONIC DEVICE SEALED BODY
Abstract:
Disclosed are a fixing material mainly comprising a silane compound polymer obtained by subjecting a silane compound mixture containing at least one kind of (1) silane compound represented by Formula (1): R1Si(OR2)p(X1)3-p (wherein R1 represents a group having an ester structure or a cyanoalkyl group; R2 represents a C1-6 alkyl group or the like; X1 represents a halogen atom; and p represents an integer of 0 to 3) and at least one kind of (2) silane compound represented by Formula (2): Si(OR3)q(X2)4-q (wherein R3 represents a C1-6 alkyl group; X2 represents a halogen atom; and q represents an integer of 0 to 4) to condensation in the presence of a catalyst; and a photonic device sealed body obtained by being sealed with a cured matter of the fixing material. The fixing material capable of obtaining a cured matter which has high hardness, shows excellent transparency and heat resistance, and exhibits less color degradation even if it is exposed to high energy light or high temperature over a long period of time; and the photonic device sealed body sealed with the cured matter of the fixing material can be realized.