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1. (WO2009119485) METAL POLISHING LIQUID AND POLISHING METHOD USING THE POLISHING LIQUID

Pub. No.:    WO/2009/119485    International Application No.:    PCT/JP2009/055621
Publication Date: Oct 1, 2009 International Filing Date: Mar 23, 2009
IPC: H01L 21/304
B24B 37/04
C09K 3/14
Applicants: HITACHI CHEMICAL COMPANY, LTD.
日立化成工業株式会社
MINAMI, Hisataka
南 久貴
FUKASAWA, Masato
深沢 正人
AMANOKURA, Jin
天野倉 仁
Inventors: MINAMI, Hisataka
南 久貴
FUKASAWA, Masato
深沢 正人
AMANOKURA, Jin
天野倉 仁
Title: METAL POLISHING LIQUID AND POLISHING METHOD USING THE POLISHING LIQUID
Abstract:
Disclosed is a metal polishing liquid containing water, an oxidizing agent, a metal oxide dissolving agent, an anticorrosive agent and a metal oxide dissolution modifier. The polishing liquid has a pH within the range of 1-5, and the anticorrosive agent contains at least tolyltriazole or diphenylguanidine. Also disclosed is a method for polishing a substrate, wherein a substrate is polished by relatively moving a polishing cloth of a polishing plate and the substrate while pressing a surface of the substrate to be polished against the polishing cloth of the polishing plate and supplying the metal polishing liquid between the substrate surface and the polishing cloth.